A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

Kuang Shun Ou, Kuo Shen Chen, Tian Shiang Yang, Sen Yung Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Beam structures are widely used in MEMS sensors and actuators. MEMS micro beams are usually curled due to residual stresses and the characteristics of micro beams subjected to both residual stress gradients and electrostatic forces must be investigated for providing accuracy information for designing sensors and actuators. In this work, a novel semi-analytical formulation to address the above needs is proposed. By assuming an admissible deformation shape and utilizing energy method to determine the coefficients of the shape functions, it is possible to find the pull-in characteristics of the curled cantilevers. Detail parametric studies are subsequently performed to quantify the influence of various geometry and processing parameters on the pull-in characteristics of those micro beams. The method and results presented in this work would be very useful for related micro sensors and actuator designs.

Original languageEnglish
Title of host publicationASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009
Pages597-606
Number of pages10
DOIs
Publication statusPublished - 2009
EventASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009 - San Diego, CA, United States
Duration: 2009 Aug 302009 Sept 2

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
Volume6

Other

OtherASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009
Country/TerritoryUnited States
CitySan Diego, CA
Period09-08-3009-09-02

All Science Journal Classification (ASJC) codes

  • Modelling and Simulation
  • Mechanical Engineering
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

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