A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

Kuang Shun Ou; Kuo Shen Chen; Tian Shiang Yang; Sen Yung Lee

doi:10.1115/DETC2009-86977

A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

Kuang Shun Ou, Kuo Shen Chen, Tian Shiang Yang, Sen Yung Lee

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Beam structures are widely used in MEMS sensors and actuators. MEMS micro beams are usually curled due to residual stresses and the characteristics of micro beams subjected to both residual stress gradients and electrostatic forces must be investigated for providing accuracy information for designing sensors and actuators. In this work, a novel semi-analytical formulation to address the above needs is proposed. By assuming an admissible deformation shape and utilizing energy method to determine the coefficients of the shape functions, it is possible to find the pull-in characteristics of the curled cantilevers. Detail parametric studies are subsequently performed to quantify the influence of various geometry and processing parameters on the pull-in characteristics of those micro beams. The method and results presented in this work would be very useful for related micro sensors and actuator designs.

Original language	English
Title of host publication	ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009
Pages	597-606
Number of pages	10
DOIs	https://doi.org/10.1115/DETC2009-86977
Publication status	Published - 2009
Event	ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009 - San Diego, CA, United States Duration: 2009 Aug 30 → 2009 Sept 2

Publication series

Name	Proceedings of the ASME Design Engineering Technical Conference
Volume	6

Other

Other	ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009
Country/Territory	United States
City	San Diego, CA
Period	09-08-30 → 09-09-02

All Science Journal Classification (ASJC) codes

Modelling and Simulation
Mechanical Engineering
Computer Science Applications
Computer Graphics and Computer-Aided Design

Access to Document

10.1115/DETC2009-86977

Cite this

Ou, K. S., Chen, K. S., Yang, T. S., & Lee, S. Y. (2009). A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. In ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009 (pp. 597-606). (Proceedings of the ASME Design Engineering Technical Conference; Vol. 6). https://doi.org/10.1115/DETC2009-86977

Ou, Kuang Shun ; Chen, Kuo Shen ; Yang, Tian Shiang et al. / A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. 2009. pp. 597-606 (Proceedings of the ASME Design Engineering Technical Conference).

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title = "A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients",

abstract = "Beam structures are widely used in MEMS sensors and actuators. MEMS micro beams are usually curled due to residual stresses and the characteristics of micro beams subjected to both residual stress gradients and electrostatic forces must be investigated for providing accuracy information for designing sensors and actuators. In this work, a novel semi-analytical formulation to address the above needs is proposed. By assuming an admissible deformation shape and utilizing energy method to determine the coefficients of the shape functions, it is possible to find the pull-in characteristics of the curled cantilevers. Detail parametric studies are subsequently performed to quantify the influence of various geometry and processing parameters on the pull-in characteristics of those micro beams. The method and results presented in this work would be very useful for related micro sensors and actuator designs.",

author = "Ou, {Kuang Shun} and Chen, {Kuo Shen} and Yang, {Tian Shiang} and Lee, {Sen Yung}",

year = "2009",

doi = "10.1115/DETC2009-86977",

language = "English",

isbn = "9780791849033",

series = "Proceedings of the ASME Design Engineering Technical Conference",

pages = "597--606",

booktitle = "ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009",

note = "ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009 ; Conference date: 30-08-2009 Through 02-09-2009",

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Ou, KS, Chen, KS , Yang, TS & Lee, SY 2009, A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. in ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. Proceedings of the ASME Design Engineering Technical Conference, vol. 6, pp. 597-606, ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009, San Diego, CA, United States, 09-08-30. https://doi.org/10.1115/DETC2009-86977

A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. / Ou, Kuang Shun; Chen, Kuo Shen ; Yang, Tian Shiang et al.
ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. 2009. p. 597-606 (Proceedings of the ASME Design Engineering Technical Conference; Vol. 6).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

AU - Ou, Kuang Shun

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N2 - Beam structures are widely used in MEMS sensors and actuators. MEMS micro beams are usually curled due to residual stresses and the characteristics of micro beams subjected to both residual stress gradients and electrostatic forces must be investigated for providing accuracy information for designing sensors and actuators. In this work, a novel semi-analytical formulation to address the above needs is proposed. By assuming an admissible deformation shape and utilizing energy method to determine the coefficients of the shape functions, it is possible to find the pull-in characteristics of the curled cantilevers. Detail parametric studies are subsequently performed to quantify the influence of various geometry and processing parameters on the pull-in characteristics of those micro beams. The method and results presented in this work would be very useful for related micro sensors and actuator designs.

AB - Beam structures are widely used in MEMS sensors and actuators. MEMS micro beams are usually curled due to residual stresses and the characteristics of micro beams subjected to both residual stress gradients and electrostatic forces must be investigated for providing accuracy information for designing sensors and actuators. In this work, a novel semi-analytical formulation to address the above needs is proposed. By assuming an admissible deformation shape and utilizing energy method to determine the coefficients of the shape functions, it is possible to find the pull-in characteristics of the curled cantilevers. Detail parametric studies are subsequently performed to quantify the influence of various geometry and processing parameters on the pull-in characteristics of those micro beams. The method and results presented in this work would be very useful for related micro sensors and actuator designs.

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Ou KS, Chen KS , Yang TS, Lee SY. A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. In ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. 2009. p. 597-606. (Proceedings of the ASME Design Engineering Technical Conference). doi: 10.1115/DETC2009-86977

A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

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