A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

Kuang Shun Ou; Kuo-Shen Chen; Tian-Shiang Yang; Sen-Yung Lee

doi:10.1115/DETC2009-86977

A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

Kuang Shun Ou, Kuo-Shen Chen, Tian-Shiang Yang, Sen-Yung Lee

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Beam structures are widely used in MEMS sensors and actuators. MEMS micro beams are usually curled due to residual stresses and the characteristics of micro beams subjected to both residual stress gradients and electrostatic forces must be investigated for providing accuracy information for designing sensors and actuators. In this work, a novel semi-analytical formulation to address the above needs is proposed. By assuming an admissible deformation shape and utilizing energy method to determine the coefficients of the shape functions, it is possible to find the pull-in characteristics of the curled cantilevers. Detail parametric studies are subsequently performed to quantify the influence of various geometry and processing parameters on the pull-in characteristics of those micro beams. The method and results presented in this work would be very useful for related micro sensors and actuator designs.

Original language	English
Title of host publication	ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009
Pages	597-606
Number of pages	10
DOIs	https://doi.org/10.1115/DETC2009-86977
Publication status	Published - 2009 Dec 1
Event	ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009 - San Diego, CA, United States Duration: 2009 Aug 30 → 2009 Sep 2

Publication series

Name	Proceedings of the ASME Design Engineering Technical Conference
Volume	6

Other

Other	ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009
Country	United States
City	San Diego, CA
Period	09-08-30 → 09-09-02

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All Science Journal Classification (ASJC) codes

Mechanical Engineering
Computer Graphics and Computer-Aided Design
Computer Science Applications
Modelling and Simulation

Cite this

Ou, K. S., Chen, K-S., Yang, T-S., & Lee, S-Y. (2009). A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. In ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009 (pp. 597-606). (Proceedings of the ASME Design Engineering Technical Conference; Vol. 6). https://doi.org/10.1115/DETC2009-86977

Ou, Kuang Shun ; Chen, Kuo-Shen ; Yang, Tian-Shiang ; Lee, Sen-Yung. / A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. 2009. pp. 597-606 (Proceedings of the ASME Design Engineering Technical Conference).

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Ou, KS, Chen, K-S , Yang, T-S & Lee, S-Y 2009, A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. in ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. Proceedings of the ASME Design Engineering Technical Conference, vol. 6, pp. 597-606, ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009, San Diego, CA, United States, 09-08-30. https://doi.org/10.1115/DETC2009-86977

A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. / Ou, Kuang Shun; Chen, Kuo-Shen ; Yang, Tian-Shiang ; Lee, Sen-Yung.

ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. 2009. p. 597-606 (Proceedings of the ASME Design Engineering Technical Conference; Vol. 6).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Ou KS, Chen K-S , Yang T-S , Lee S-Y. A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. In ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. 2009. p. 597-606. (Proceedings of the ASME Design Engineering Technical Conference). https://doi.org/10.1115/DETC2009-86977

Access to Document

10.1115/DETC2009-86977