A novel TLP bonding based on sub-micron Ga particles

Shih-kang Lin, Hseng Ming Liao, Che Yu Yeh, Chih Han Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In recent years, electronic devices used in our ordinary life become powerful and multifunctional, such as virtual reality (VR), internet of things (IoT), also the electrical vehicle. 3D IC and wide bandgap (WBG) semiconductor packaging are one of the most notable technologies in electronic packaging industries [1]-[3]. However, Conventional packaging technologies are gradually unable to meet the requirements of 3D IC or high-power devices operated in extremely harsh environments. In our previous work, we proposed a novel approach based on a transient liquid phase (TLP) bonding for forming face-centered cubic solid-solution joints without the formation of intermetallic compounds. A trace amount of gallium (Ga) and nickel (Ni) in an under-bump-metallurgy (UBM) process at 300°C for 24 h with high-strength and excellent thermal stability. In this study, due to the high surface tension of liquid Ga and the long time it takes to form the bonding joints, liquid Ga was replaced with Ga-based submicron particles (SMPs) by a sonochemical process. With Ga-based paste and Ni UBM, high-strength, thermally stable, and low resistance Cu-To-Cu bonding joints can be fabricated at a relatively low temperature and short bonding time comparing to the process reported in our previous work. The industrial application of Ga-based SMPs was conclusively demonstrated by a series of evaluations of Ga-based SMPs and Cu-To-Cu bonding joints.

Original languageEnglish
Title of host publication2019 International Conference on Electronics Packaging, ICEP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages240-241
Number of pages2
ISBN (Electronic)9784990218867
DOIs
Publication statusPublished - 2019 Apr 1
Event2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
Duration: 2019 Apr 172019 Apr 20

Publication series

Name2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
CountryJapan
CityNiigata
Period19-04-1719-04-20

Fingerprint

Gallium
Liquids
Metallurgy
Nickel
Packaging
Electronics packaging
Ointments
Virtual reality
Industrial applications
Intermetallics
Surface tension
Solid solutions
Energy gap
Thermodynamic stability
Semiconductor materials

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

Cite this

Lin, S., Liao, H. M., Yeh, C. Y., & Yang, C. H. (2019). A novel TLP bonding based on sub-micron Ga particles. In 2019 International Conference on Electronics Packaging, ICEP 2019 (pp. 240-241). [8733446] (2019 International Conference on Electronics Packaging, ICEP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2019.8733446
Lin, Shih-kang ; Liao, Hseng Ming ; Yeh, Che Yu ; Yang, Chih Han. / A novel TLP bonding based on sub-micron Ga particles. 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 240-241 (2019 International Conference on Electronics Packaging, ICEP 2019).
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abstract = "In recent years, electronic devices used in our ordinary life become powerful and multifunctional, such as virtual reality (VR), internet of things (IoT), also the electrical vehicle. 3D IC and wide bandgap (WBG) semiconductor packaging are one of the most notable technologies in electronic packaging industries [1]-[3]. However, Conventional packaging technologies are gradually unable to meet the requirements of 3D IC or high-power devices operated in extremely harsh environments. In our previous work, we proposed a novel approach based on a transient liquid phase (TLP) bonding for forming face-centered cubic solid-solution joints without the formation of intermetallic compounds. A trace amount of gallium (Ga) and nickel (Ni) in an under-bump-metallurgy (UBM) process at 300°C for 24 h with high-strength and excellent thermal stability. In this study, due to the high surface tension of liquid Ga and the long time it takes to form the bonding joints, liquid Ga was replaced with Ga-based submicron particles (SMPs) by a sonochemical process. With Ga-based paste and Ni UBM, high-strength, thermally stable, and low resistance Cu-To-Cu bonding joints can be fabricated at a relatively low temperature and short bonding time comparing to the process reported in our previous work. The industrial application of Ga-based SMPs was conclusively demonstrated by a series of evaluations of Ga-based SMPs and Cu-To-Cu bonding joints.",
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Lin, S, Liao, HM, Yeh, CY & Yang, CH 2019, A novel TLP bonding based on sub-micron Ga particles. in 2019 International Conference on Electronics Packaging, ICEP 2019., 8733446, 2019 International Conference on Electronics Packaging, ICEP 2019, Institute of Electrical and Electronics Engineers Inc., pp. 240-241, 2019 International Conference on Electronics Packaging, ICEP 2019, Niigata, Japan, 19-04-17. https://doi.org/10.23919/ICEP.2019.8733446

A novel TLP bonding based on sub-micron Ga particles. / Lin, Shih-kang; Liao, Hseng Ming; Yeh, Che Yu; Yang, Chih Han.

2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 240-241 8733446 (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - In recent years, electronic devices used in our ordinary life become powerful and multifunctional, such as virtual reality (VR), internet of things (IoT), also the electrical vehicle. 3D IC and wide bandgap (WBG) semiconductor packaging are one of the most notable technologies in electronic packaging industries [1]-[3]. However, Conventional packaging technologies are gradually unable to meet the requirements of 3D IC or high-power devices operated in extremely harsh environments. In our previous work, we proposed a novel approach based on a transient liquid phase (TLP) bonding for forming face-centered cubic solid-solution joints without the formation of intermetallic compounds. A trace amount of gallium (Ga) and nickel (Ni) in an under-bump-metallurgy (UBM) process at 300°C for 24 h with high-strength and excellent thermal stability. In this study, due to the high surface tension of liquid Ga and the long time it takes to form the bonding joints, liquid Ga was replaced with Ga-based submicron particles (SMPs) by a sonochemical process. With Ga-based paste and Ni UBM, high-strength, thermally stable, and low resistance Cu-To-Cu bonding joints can be fabricated at a relatively low temperature and short bonding time comparing to the process reported in our previous work. The industrial application of Ga-based SMPs was conclusively demonstrated by a series of evaluations of Ga-based SMPs and Cu-To-Cu bonding joints.

AB - In recent years, electronic devices used in our ordinary life become powerful and multifunctional, such as virtual reality (VR), internet of things (IoT), also the electrical vehicle. 3D IC and wide bandgap (WBG) semiconductor packaging are one of the most notable technologies in electronic packaging industries [1]-[3]. However, Conventional packaging technologies are gradually unable to meet the requirements of 3D IC or high-power devices operated in extremely harsh environments. In our previous work, we proposed a novel approach based on a transient liquid phase (TLP) bonding for forming face-centered cubic solid-solution joints without the formation of intermetallic compounds. A trace amount of gallium (Ga) and nickel (Ni) in an under-bump-metallurgy (UBM) process at 300°C for 24 h with high-strength and excellent thermal stability. In this study, due to the high surface tension of liquid Ga and the long time it takes to form the bonding joints, liquid Ga was replaced with Ga-based submicron particles (SMPs) by a sonochemical process. With Ga-based paste and Ni UBM, high-strength, thermally stable, and low resistance Cu-To-Cu bonding joints can be fabricated at a relatively low temperature and short bonding time comparing to the process reported in our previous work. The industrial application of Ga-based SMPs was conclusively demonstrated by a series of evaluations of Ga-based SMPs and Cu-To-Cu bonding joints.

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M3 - Conference contribution

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BT - 2019 International Conference on Electronics Packaging, ICEP 2019

PB - Institute of Electrical and Electronics Engineers Inc.

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Lin S, Liao HM, Yeh CY, Yang CH. A novel TLP bonding based on sub-micron Ga particles. In 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 240-241. 8733446. (2019 International Conference on Electronics Packaging, ICEP 2019). https://doi.org/10.23919/ICEP.2019.8733446