A polymer stacking process with 3D electrical routings for flexible temperature sensor array and its heterogeneous integration

Wang Shen Su, Chang Hung Chen, Chih Chun Lee, Yu-Cheng Lin, Weileun Fang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This study presents an unique process to integrate the temperature sensing/heating elements, multi-layer through-hole vias (THVs), and electrical routings on parylene substrate to implement a multi-functional flexible temperature sensor array. Moreover, the polymer-staking processes with 3D electrical routings enable the further integration of various devices. In application, this study also demonstrates the implementation and integration of flexible temperature sensor array by: (1) temperature distribution and contour measurement using 4×4 temperature sensor array, (2) temperature monitoring and control using the integration of Pt-sensor and Pt-heater, (3) heterogeneous integration of temperature sensor array with LED-chip for LED temperature monitoring, and (4) 3D integration of temperature sensor array with LED and micro-lens and micro chamber.

Original languageEnglish
Title of host publication2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
Pages1396-1399
Number of pages4
DOIs
Publication statusPublished - 2011 Sep 1
Event2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 - Beijing, China
Duration: 2011 Jun 52011 Jun 9

Publication series

Name2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Other

Other2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
CountryChina
CityBeijing
Period11-06-0511-06-09

Fingerprint

Sensor arrays
Temperature sensors
Light emitting diodes
Polymers
Contour measurement
Electric heating elements
Monitoring
Temperature
Lenses
Temperature distribution
Sensors
Substrates

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Su, W. S., Chen, C. H., Lee, C. C., Lin, Y-C., & Fang, W. (2011). A polymer stacking process with 3D electrical routings for flexible temperature sensor array and its heterogeneous integration. In 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 (pp. 1396-1399). [5969532] (2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11). https://doi.org/10.1109/TRANSDUCERS.2011.5969532
Su, Wang Shen ; Chen, Chang Hung ; Lee, Chih Chun ; Lin, Yu-Cheng ; Fang, Weileun. / A polymer stacking process with 3D electrical routings for flexible temperature sensor array and its heterogeneous integration. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11. 2011. pp. 1396-1399 (2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11).
@inproceedings{105896a06e914d6097ba095bc70f7a6d,
title = "A polymer stacking process with 3D electrical routings for flexible temperature sensor array and its heterogeneous integration",
abstract = "This study presents an unique process to integrate the temperature sensing/heating elements, multi-layer through-hole vias (THVs), and electrical routings on parylene substrate to implement a multi-functional flexible temperature sensor array. Moreover, the polymer-staking processes with 3D electrical routings enable the further integration of various devices. In application, this study also demonstrates the implementation and integration of flexible temperature sensor array by: (1) temperature distribution and contour measurement using 4×4 temperature sensor array, (2) temperature monitoring and control using the integration of Pt-sensor and Pt-heater, (3) heterogeneous integration of temperature sensor array with LED-chip for LED temperature monitoring, and (4) 3D integration of temperature sensor array with LED and micro-lens and micro chamber.",
author = "Su, {Wang Shen} and Chen, {Chang Hung} and Lee, {Chih Chun} and Yu-Cheng Lin and Weileun Fang",
year = "2011",
month = "9",
day = "1",
doi = "10.1109/TRANSDUCERS.2011.5969532",
language = "English",
isbn = "9781457701573",
series = "2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11",
pages = "1396--1399",
booktitle = "2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11",

}

Su, WS, Chen, CH, Lee, CC, Lin, Y-C & Fang, W 2011, A polymer stacking process with 3D electrical routings for flexible temperature sensor array and its heterogeneous integration. in 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11., 5969532, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11, pp. 1396-1399, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11, Beijing, China, 11-06-05. https://doi.org/10.1109/TRANSDUCERS.2011.5969532

A polymer stacking process with 3D electrical routings for flexible temperature sensor array and its heterogeneous integration. / Su, Wang Shen; Chen, Chang Hung; Lee, Chih Chun; Lin, Yu-Cheng; Fang, Weileun.

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11. 2011. p. 1396-1399 5969532 (2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - A polymer stacking process with 3D electrical routings for flexible temperature sensor array and its heterogeneous integration

AU - Su, Wang Shen

AU - Chen, Chang Hung

AU - Lee, Chih Chun

AU - Lin, Yu-Cheng

AU - Fang, Weileun

PY - 2011/9/1

Y1 - 2011/9/1

N2 - This study presents an unique process to integrate the temperature sensing/heating elements, multi-layer through-hole vias (THVs), and electrical routings on parylene substrate to implement a multi-functional flexible temperature sensor array. Moreover, the polymer-staking processes with 3D electrical routings enable the further integration of various devices. In application, this study also demonstrates the implementation and integration of flexible temperature sensor array by: (1) temperature distribution and contour measurement using 4×4 temperature sensor array, (2) temperature monitoring and control using the integration of Pt-sensor and Pt-heater, (3) heterogeneous integration of temperature sensor array with LED-chip for LED temperature monitoring, and (4) 3D integration of temperature sensor array with LED and micro-lens and micro chamber.

AB - This study presents an unique process to integrate the temperature sensing/heating elements, multi-layer through-hole vias (THVs), and electrical routings on parylene substrate to implement a multi-functional flexible temperature sensor array. Moreover, the polymer-staking processes with 3D electrical routings enable the further integration of various devices. In application, this study also demonstrates the implementation and integration of flexible temperature sensor array by: (1) temperature distribution and contour measurement using 4×4 temperature sensor array, (2) temperature monitoring and control using the integration of Pt-sensor and Pt-heater, (3) heterogeneous integration of temperature sensor array with LED-chip for LED temperature monitoring, and (4) 3D integration of temperature sensor array with LED and micro-lens and micro chamber.

UR - http://www.scopus.com/inward/record.url?scp=80052136103&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=80052136103&partnerID=8YFLogxK

U2 - 10.1109/TRANSDUCERS.2011.5969532

DO - 10.1109/TRANSDUCERS.2011.5969532

M3 - Conference contribution

AN - SCOPUS:80052136103

SN - 9781457701573

T3 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

SP - 1396

EP - 1399

BT - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

ER -

Su WS, Chen CH, Lee CC, Lin Y-C, Fang W. A polymer stacking process with 3D electrical routings for flexible temperature sensor array and its heterogeneous integration. In 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11. 2011. p. 1396-1399. 5969532. (2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11). https://doi.org/10.1109/TRANSDUCERS.2011.5969532