The Sn-Zn alloy exhibits the closest eutectic temperature to the eutectic Sn-Pb solder, although it suffers an easy oxidation characteristic. A novel alloy based on the Sn-Zn eutectic alloy was developed and found promising as a drop-in replacement for the eutectic Sn-Pb solder. This alloy, consisting of a Sn-Zn-Ag-Al-Ga combination, was developed, showing promising properties. Differential scanning calorimetry (DSC) investigation reveals that the investigated solder exhibits a eutectic temperature of around 199°C. The thermal gravimetric analysis (TGA) study shows it attains much better oxidation resistance than the eutectic Sn-Pb solder does at 250°C. The stress-strain curve indicates that this solder also possesses a higher ultimate tensile strength (UTS) and a better ductility than the eutectic Sn-Pb solder. A wetting time, on Cu, of less than 1 sec was found for this solder with a suitable, organic acid-activated flux. Gallium tended to enhance wetting behavior. The cost of this solder was also estimated and was found to be comparable with the Sn-Pb solder.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry