A Potential Drop-In Replacement for Eutectic Sn-Pb Solder - The Sn-Zn-Ag-Al-Ga Solder

Kwang Lung Lin, Kang I. Chen, Po Cheng Shi

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)

Abstract

The Sn-Zn alloy exhibits the closest eutectic temperature to the eutectic Sn-Pb solder, although it suffers an easy oxidation characteristic. A novel alloy based on the Sn-Zn eutectic alloy was developed and found promising as a drop-in replacement for the eutectic Sn-Pb solder. This alloy, consisting of a Sn-Zn-Ag-Al-Ga combination, was developed, showing promising properties. Differential scanning calorimetry (DSC) investigation reveals that the investigated solder exhibits a eutectic temperature of around 199°C. The thermal gravimetric analysis (TGA) study shows it attains much better oxidation resistance than the eutectic Sn-Pb solder does at 250°C. The stress-strain curve indicates that this solder also possesses a higher ultimate tensile strength (UTS) and a better ductility than the eutectic Sn-Pb solder. A wetting time, on Cu, of less than 1 sec was found for this solder with a suitable, organic acid-activated flux. Gallium tended to enhance wetting behavior. The cost of this solder was also estimated and was found to be comparable with the Sn-Pb solder.

Original languageEnglish
Pages (from-to)1490-1495
Number of pages6
JournalJournal of Electronic Materials
Volume32
Issue number12
DOIs
Publication statusPublished - 2003 Jan 2

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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