A reexamination of residualstresses in thin films and of thevalidity of stoney’s estimate

C. Y. Hui, H. D. Conway, Y. Y. Lin

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)

Abstract

The residual stresses in thin films are explained using elementary mechanics. In particu-lar, the range of validity of the well-known Stoney’s formula is examined using a strength of materials approach. An improved formula is obtained. The results of these analysescan also be used to compute energy release rates for cracks in thin film systems. Some simple examples of such applications are given.

Original languageEnglish
Pages (from-to)267-273
Number of pages7
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume122
Issue number3
DOIs
Publication statusPublished - 2000 Sep

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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