Abstract
The use of co-sputtered zirconium silicon oxide (ZrxSi1-xO2) gate dielectrics to improve the gate controllability of amorphous indium gallium zinc oxide (α-IGZO) thin-film transistors (TFTs) through a room-temperature fabrication process is proposed and demonstrated. With the sputtering power of the SiO2 target in the range of 0-150W and with that of the ZrO2 target kept at 100W, a dielectric constant ranging from approximately 28.1 to 7.8 is obtained. The poly-structure formation immunity of the ZrxSi1-xO2 dielectrics, reduction of the interface trap density suppression, and gate leakage current are examined. Our experimental results reveal that the Zr0.85Si0.15O2 gate dielectric can lead to significantly improved TFT subthreshold swing performance (103mV/dec) and field effect mobility (33.76 cm2V%1 s%1).
Original language | English |
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Article number | 04CG06 |
Journal | Japanese journal of applied physics |
Volume | 56 |
Issue number | 4 |
DOIs | |
Publication status | Published - 2017 Apr |
All Science Journal Classification (ASJC) codes
- General Engineering
- General Physics and Astronomy