A simultaneously sensing system to improve efficiency of Digital Light Process Printing

Yu Sheng Lin, Ming Huang Chen, Cheng Jung Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Digital Light Process (DLP) is a common technology used in 3D printing. However, problems such as non-proper adhesive usually happen without vibration of the resin tank during the separation scenario in DLP. Therefore, this study aims to develop a real-Time system to earlier detect these problems by monitoring vibration of the resin tank. If no vibration is detected, a false alarm via internet to APP will be created. By this system, the experience of using DLP printing will be improved.

Original languageEnglish
Title of host publicationProceedings of the 2017 IEEE International Conference on Applied System Innovation
Subtitle of host publicationApplied System Innovation for Modern Technology, ICASI 2017
EditorsTeen-Hang Meen, Artde Donald Kin-Tak Lam, Stephen D. Prior
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1379-1382
Number of pages4
ISBN (Electronic)9781509048977
DOIs
Publication statusPublished - 2017 Jul 21
Event2017 IEEE International Conference on Applied System Innovation, ICASI 2017 - Sapporo, Japan
Duration: 2017 May 132017 May 17

Publication series

NameProceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017

Other

Other2017 IEEE International Conference on Applied System Innovation, ICASI 2017
CountryJapan
CitySapporo
Period17-05-1317-05-17

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All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Computer Science Applications
  • Hardware and Architecture
  • Safety, Risk, Reliability and Quality
  • Mechanical Engineering
  • Media Technology
  • Health Informatics
  • Instrumentation

Cite this

Lin, Y. S., Chen, M. H., & Yang, C. J. (2017). A simultaneously sensing system to improve efficiency of Digital Light Process Printing. In T-H. Meen, A. D. K-T. Lam, & S. D. Prior (Eds.), Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017 (pp. 1379-1382). [7988164] (Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICASI.2017.7988164