A study of Cu/CuMn barrier for 22-nm semiconductor manufacturing

Sze Ann Wu, Yi Lung Cheng, Chia Yang Wu, Wen-Shi Lee

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

The barrier properties of self-forming barrier are sensitive to the thickness, annealing temperature, annealing time, and impurity concentration of itself. In this paper, the properties of Cu/CuMn/ SiO2 bilayer structures were investigated, and an optimized thickness of Cu and CuMn alloy used as barrier layers in these bilayer structures was also determined. The bilayer structure could reduce the resistance of barrier and improve the surface morphology in electroplating process because Mn is easier to be corroded and oxidized than Cu in sulfuric acid. The electrical and material properties of Cu/CuMn/SiO2 were studied. A diffusion barrier layer self-formed at the interface during annealing, and the growth behavior followed a logarithmic rate law. The microstructures of the metal films were analyzed by transmission electron microscopy (TEM) and then correlated with the electrical properties of the CuMn films. After annealing, the thermal stability of Cu/ CuMn films was better than single Cu film and CuMn film. When Cu layer was capped, the Mn atoms diffused easily to the interface due to high chemical potential of the Cu layer. Thus, Mn atoms tend to move to SiO2, and the amount of surplus Mn atoms in Cu will reduce after heat treatment.

Original languageEnglish
Article number6515175
Pages (from-to)286-290
Number of pages5
JournalIEEE Transactions on Device and Materials Reliability
Volume14
Issue number1
DOIs
Publication statusPublished - 2014 Jan 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

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