A study of green Sn-xZn photovoltaic ribbons for solar cell application

Kuan Jen Chen, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Yu Wen Chen

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

Sn-xZn (x=9, 25, and 50 wt%) alloy solders were applied in a photovoltaic (PV) ribbon. The effects of intermetallic compounds (IMCs) on series resistance and bond reliability of Sn-xZn PV modules were investigated. Cu5Zn8 and AgZn3 IMCs were found at the interfaces (solder/Cu and solder/Ag). The Zn content in the solder dominated the growth behavior of IMCs at the interface. The IMC thickness increased with increasing Zn content in the solder, and thus the bond reliability of the PV module deteriorated. After a bias was applied for a long duration, the interfacial characteristics and solder matrix were affected by the bias-induced thermal diffusion. In addition, the evolution in IMCs due to thermal diffusion during bias changed the original series resistance of the ribbon material and affected the series resistance of the PV module.

Original languageEnglish
Pages (from-to)561-566
Number of pages6
JournalSolar Energy Materials and Solar Cells
Volume143
DOIs
Publication statusPublished - 2015 Jan 1

Fingerprint

Soldering alloys
Solar cells
Intermetallics
Thermal diffusion

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films

Cite this

@article{9489eb4b3e1c4439a05fe665397ad8de,
title = "A study of green Sn-xZn photovoltaic ribbons for solar cell application",
abstract = "Sn-xZn (x=9, 25, and 50 wt{\%}) alloy solders were applied in a photovoltaic (PV) ribbon. The effects of intermetallic compounds (IMCs) on series resistance and bond reliability of Sn-xZn PV modules were investigated. Cu5Zn8 and AgZn3 IMCs were found at the interfaces (solder/Cu and solder/Ag). The Zn content in the solder dominated the growth behavior of IMCs at the interface. The IMC thickness increased with increasing Zn content in the solder, and thus the bond reliability of the PV module deteriorated. After a bias was applied for a long duration, the interfacial characteristics and solder matrix were affected by the bias-induced thermal diffusion. In addition, the evolution in IMCs due to thermal diffusion during bias changed the original series resistance of the ribbon material and affected the series resistance of the PV module.",
author = "Chen, {Kuan Jen} and Hung, {Fei Yi} and Lui, {Truan Sheng} and Chen, {Li Hui} and Chen, {Yu Wen}",
year = "2015",
month = "1",
day = "1",
doi = "10.1016/j.solmat.2015.08.007",
language = "English",
volume = "143",
pages = "561--566",
journal = "Solar Energy Materials and Solar Cells",
issn = "0927-0248",
publisher = "Elsevier",

}

A study of green Sn-xZn photovoltaic ribbons for solar cell application. / Chen, Kuan Jen; Hung, Fei Yi; Lui, Truan Sheng; Chen, Li Hui; Chen, Yu Wen.

In: Solar Energy Materials and Solar Cells, Vol. 143, 01.01.2015, p. 561-566.

Research output: Contribution to journalArticle

TY - JOUR

T1 - A study of green Sn-xZn photovoltaic ribbons for solar cell application

AU - Chen, Kuan Jen

AU - Hung, Fei Yi

AU - Lui, Truan Sheng

AU - Chen, Li Hui

AU - Chen, Yu Wen

PY - 2015/1/1

Y1 - 2015/1/1

N2 - Sn-xZn (x=9, 25, and 50 wt%) alloy solders were applied in a photovoltaic (PV) ribbon. The effects of intermetallic compounds (IMCs) on series resistance and bond reliability of Sn-xZn PV modules were investigated. Cu5Zn8 and AgZn3 IMCs were found at the interfaces (solder/Cu and solder/Ag). The Zn content in the solder dominated the growth behavior of IMCs at the interface. The IMC thickness increased with increasing Zn content in the solder, and thus the bond reliability of the PV module deteriorated. After a bias was applied for a long duration, the interfacial characteristics and solder matrix were affected by the bias-induced thermal diffusion. In addition, the evolution in IMCs due to thermal diffusion during bias changed the original series resistance of the ribbon material and affected the series resistance of the PV module.

AB - Sn-xZn (x=9, 25, and 50 wt%) alloy solders were applied in a photovoltaic (PV) ribbon. The effects of intermetallic compounds (IMCs) on series resistance and bond reliability of Sn-xZn PV modules were investigated. Cu5Zn8 and AgZn3 IMCs were found at the interfaces (solder/Cu and solder/Ag). The Zn content in the solder dominated the growth behavior of IMCs at the interface. The IMC thickness increased with increasing Zn content in the solder, and thus the bond reliability of the PV module deteriorated. After a bias was applied for a long duration, the interfacial characteristics and solder matrix were affected by the bias-induced thermal diffusion. In addition, the evolution in IMCs due to thermal diffusion during bias changed the original series resistance of the ribbon material and affected the series resistance of the PV module.

UR - http://www.scopus.com/inward/record.url?scp=84957015785&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84957015785&partnerID=8YFLogxK

U2 - 10.1016/j.solmat.2015.08.007

DO - 10.1016/j.solmat.2015.08.007

M3 - Article

AN - SCOPUS:84957015785

VL - 143

SP - 561

EP - 566

JO - Solar Energy Materials and Solar Cells

JF - Solar Energy Materials and Solar Cells

SN - 0927-0248

ER -