A study of reducing the residual stresses for multilayer chip inductors

Shih Feng Chien, Yin Lai Tsai, S. H. Wang, Wen Hsi Lee, Wen Yu Lin, Pei Yi Wei

Research output: Contribution to journalArticlepeer-review


The residual stress built up by sintering causes not only the destruction of the structure of magnetic components, but also a reduction in their permeability. This paper examined the relationship between residual stress and permeability, and provided two possible methods to improve this situation. Because one of the causes of increased residual stress is competition between the shrinkage behavior from the silver and ceramic layers inside the components during sintering process, the first method is changing the particle size of the silver paste to alter its shrinkage behavior. The results show that choosing a finer silver particle paste as the inner electrode material can reduce the onset temperature of shrinkage of the silver layer, and then make it separate from the ceramic layer to shrink individually, reducing the level of residual stress. The second approach is based on the phenomenon of separate shrinkage seen in the first method, and we used carbon paste as the isolation layer for the silver and ceramic layers to achieve this. The results show that this method can reduce the residual stress more than the first one, although it can cause high DCR (Direct Current Resistance) and low bending strength, and other conditions should be considered in order to avoid these weaknesses.

Original languageEnglish
Pages (from-to)78-90
Number of pages13
Issue number1
Publication statusPublished - 2012 Jan 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Fingerprint Dive into the research topics of 'A study of reducing the residual stresses for multilayer chip inductors'. Together they form a unique fingerprint.

Cite this