A study of reducing the residual stresses for multilayer chip inductors

Shih Feng Chien, Yin Lai Tsai, S. H. Wang, Wen-Shi Lee, Wen Yu Lin, Pei Yi Wei

Research output: Contribution to journalArticle

Abstract

The residual stress built up by sintering causes not only the destruction of the structure of magnetic components, but also a reduction in their permeability. This paper examined the relationship between residual stress and permeability, and provided two possible methods to improve this situation. Because one of the causes of increased residual stress is competition between the shrinkage behavior from the silver and ceramic layers inside the components during sintering process, the first method is changing the particle size of the silver paste to alter its shrinkage behavior. The results show that choosing a finer silver particle paste as the inner electrode material can reduce the onset temperature of shrinkage of the silver layer, and then make it separate from the ceramic layer to shrink individually, reducing the level of residual stress. The second approach is based on the phenomenon of separate shrinkage seen in the first method, and we used carbon paste as the isolation layer for the silver and ceramic layers to achieve this. The results show that this method can reduce the residual stress more than the first one, although it can cause high DCR (Direct Current Resistance) and low bending strength, and other conditions should be considered in order to avoid these weaknesses.

Original languageEnglish
Pages (from-to)78-90
Number of pages13
JournalFerroelectrics
Volume435
Issue number1
DOIs
Publication statusPublished - 2012 Jan 1

Fingerprint

inductors
Silver
residual stress
Residual stresses
Multilayers
shrinkage
chips
silver
Ointments
ceramics
causes
sintering
permeability
Sintering
flexural strength
electrode materials
Bending strength
destruction
isolation
Carbon

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Chien, Shih Feng ; Tsai, Yin Lai ; Wang, S. H. ; Lee, Wen-Shi ; Lin, Wen Yu ; Wei, Pei Yi. / A study of reducing the residual stresses for multilayer chip inductors. In: Ferroelectrics. 2012 ; Vol. 435, No. 1. pp. 78-90.
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A study of reducing the residual stresses for multilayer chip inductors. / Chien, Shih Feng; Tsai, Yin Lai; Wang, S. H.; Lee, Wen-Shi; Lin, Wen Yu; Wei, Pei Yi.

In: Ferroelectrics, Vol. 435, No. 1, 01.01.2012, p. 78-90.

Research output: Contribution to journalArticle

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