A study of the self-assembled mono-layer deposition process for the anti-adhesion of nano-imprint stamps

Kuan Wei Chen, Hung Yi Lin, Fuh Yu Chang, Shuo Hung Chan, Tung Chuan Wu, Jen-Fin Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The adhesion phenomenon of nano-imprint stamps will inevitably be one of the key issues for industrial applications of nano-imprint processes. The study of processes involving application of a thin film of chlorosilane on the surface of stamp that then attracts more and more attentions has resulted in documentation of promising solutions. However, the deposition of chlorosilane must be at under water-free atmosphere in order to achieve positive results. This study described below involves using a vacuum chamber and heating system designed to rapidly deposit high quality chlorosilane film onto silicon and nickel-based stamps through the vapor phase deposition method. The quality of anti-adhesion of the coated stamps has been investigated by imprinting experiments. The contact angles of the coated stamps after hundreds of imprints remain nearly the same as those of the as-deposited stamps.

Original languageEnglish
Title of host publication2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006
Pages592-594
Number of pages3
Publication statusPublished - 2006 Dec 1
Event2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006 - Cincinnati, OH, United States
Duration: 2006 Jun 172006 Jun 20

Publication series

Name2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006
Volume2

Other

Other2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006
CountryUnited States
CityCincinnati, OH
Period06-06-1706-06-20

Fingerprint

Adhesion
Silicon
Nickel
Industrial applications
Contact angle
Deposits
Vapors
Vacuum
Heating
Thin films
Water
Experiments

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Materials Science(all)

Cite this

Chen, K. W., Lin, H. Y., Chang, F. Y., Chan, S. H., Wu, T. C., & Lin, J-F. (2006). A study of the self-assembled mono-layer deposition process for the anti-adhesion of nano-imprint stamps. In 2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006 (pp. 592-594). [1717172] (2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006; Vol. 2).
Chen, Kuan Wei ; Lin, Hung Yi ; Chang, Fuh Yu ; Chan, Shuo Hung ; Wu, Tung Chuan ; Lin, Jen-Fin. / A study of the self-assembled mono-layer deposition process for the anti-adhesion of nano-imprint stamps. 2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006. 2006. pp. 592-594 (2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006).
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Chen, KW, Lin, HY, Chang, FY, Chan, SH, Wu, TC & Lin, J-F 2006, A study of the self-assembled mono-layer deposition process for the anti-adhesion of nano-imprint stamps. in 2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006., 1717172, 2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006, vol. 2, pp. 592-594, 2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006, Cincinnati, OH, United States, 06-06-17.

A study of the self-assembled mono-layer deposition process for the anti-adhesion of nano-imprint stamps. / Chen, Kuan Wei; Lin, Hung Yi; Chang, Fuh Yu; Chan, Shuo Hung; Wu, Tung Chuan; Lin, Jen-Fin.

2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006. 2006. p. 592-594 1717172 (2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006; Vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chen KW, Lin HY, Chang FY, Chan SH, Wu TC, Lin J-F. A study of the self-assembled mono-layer deposition process for the anti-adhesion of nano-imprint stamps. In 2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006. 2006. p. 592-594. 1717172. (2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006).