A study of the sulfidation behavior on palladium-coated copper wire with a flash-gold layer (Pca) after wire bonding

Kuan Jen Chen, Fei Yi Hung, Chia Yun Chang

Research output: Contribution to journalArticlepeer-review

Abstract

Palladium-coated copper wire with a flash-gold layer (PCA) is an oxidation-resistant fine wire that simultaneously has the properties of palladium-coated copper wire (PCC) and gold-coated copper wire. This research used an extreme sulfidation test to compare corrosion resistance between the PCC and PCA wires. In addition to closely examining the morphology of the wires, the internal matrix after the sulfidation test is also discussed. In doing so, the PCA wire was bonded onto the aluminum pads and the sulfidation test was conducted. Then, we observed its morphology and elemental distribution and found that the flash-gold layer of the PCA wire effectively enhanced resistance to sulfidation corrosion. Because the copper ball had an alloying effect on the ball bonding, it produced different shapes of sulfide after the sulfidation test. The degree of corrosion on the wedge bond was different because of the presence or absence of the coated layer. In contrast, the flash-gold layer of the PCA wire enhanced the bonding force and retained low resistance characteristics after the sulfidation test.

Original languageEnglish
Article number792
JournalElectronics (Switzerland)
Volume8
Issue number7
DOIs
Publication statusPublished - 2019 Jul

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Signal Processing
  • Hardware and Architecture
  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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