A Study of Underfill Dispensing Patterns in Flip-Chip Packaging

Dao Long Chen; Hui Jing Chang; Tang Yuan Chen; Yung Hsiang Hu; Ting Bin Chen; Chi Hung Pan; Yu Shuo Yang; Sheng Jye Hwang

doi:10.23919/ICEP58572.2023.10129757

A Study of Underfill Dispensing Patterns in Flip-Chip Packaging

Dao Long Chen, Hui Jing Chang, Tang Yuan Chen, Yung Hsiang Hu, Ting Bin Chen, Chi Hung Pan, Yu Shuo Yang, Sheng Jye Hwang

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

In view of the continuous growth of digital-twin in the technology and industry in recent years, this study conducted the digital mapping of the underfill dispensing process through experiment and simulation to understand and solve the void problem that frequently occurred in flip-chip packaging.

Original language	English
Title of host publication	2023 International Conference on Electronics Packaging, ICEP 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	115-116
Number of pages	2
ISBN (Electronic)	9784991191152
DOIs	https://doi.org/10.23919/ICEP58572.2023.10129757
Publication status	Published - 2023
Event	22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan Duration: 2023 Apr 19 → 2023 Apr 22

Publication series

Name	2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference	22nd International Conference on Electronics Packaging, ICEP 2023
Country/Territory	Japan
City	Kumamoto
Period	23-04-19 → 23-04-22

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Mechanics of Materials
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

Access to Document

10.23919/ICEP58572.2023.10129757

Cite this

Chen, D. L., Chang, H. J., Chen, T. Y., Hu, Y. H., Chen, T. B., Pan, C. H., Yang, Y. S., & Hwang, S. J. (2023). A Study of Underfill Dispensing Patterns in Flip-Chip Packaging. In 2023 International Conference on Electronics Packaging, ICEP 2023 (pp. 115-116). (2023 International Conference on Electronics Packaging, ICEP 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP58572.2023.10129757

@inproceedings{d5a999973c9047caabf24b4851aa71af,

title = "A Study of Underfill Dispensing Patterns in Flip-Chip Packaging",

abstract = "In view of the continuous growth of digital-twin in the technology and industry in recent years, this study conducted the digital mapping of the underfill dispensing process through experiment and simulation to understand and solve the void problem that frequently occurred in flip-chip packaging.",

author = "Chen, {Dao Long} and Chang, {Hui Jing} and Chen, {Tang Yuan} and Hu, {Yung Hsiang} and Chen, {Ting Bin} and Pan, {Chi Hung} and Yang, {Yu Shuo} and Hwang, {Sheng Jye}",

note = "Publisher Copyright: {\textcopyright} 2023 Japan Institute of Electronics Packaging.; 22nd International Conference on Electronics Packaging, ICEP 2023 ; Conference date: 19-04-2023 Through 22-04-2023",

year = "2023",

doi = "10.23919/ICEP58572.2023.10129757",

language = "English",

series = "2023 International Conference on Electronics Packaging, ICEP 2023",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "115--116",

booktitle = "2023 International Conference on Electronics Packaging, ICEP 2023",

address = "United States",

}

Chen, DL, Chang, HJ, Chen, TY, Hu, YH, Chen, TB, Pan, CH, Yang, YS & Hwang, SJ 2023, A Study of Underfill Dispensing Patterns in Flip-Chip Packaging. in 2023 International Conference on Electronics Packaging, ICEP 2023. 2023 International Conference on Electronics Packaging, ICEP 2023, Institute of Electrical and Electronics Engineers Inc., pp. 115-116, 22nd International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 23-04-19. https://doi.org/10.23919/ICEP58572.2023.10129757

A Study of Underfill Dispensing Patterns in Flip-Chip Packaging. / Chen, Dao Long; Chang, Hui Jing; Chen, Tang Yuan et al.
2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 115-116 (2023 International Conference on Electronics Packaging, ICEP 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - A Study of Underfill Dispensing Patterns in Flip-Chip Packaging

AU - Chen, Dao Long

AU - Chang, Hui Jing

AU - Chen, Tang Yuan

AU - Hu, Yung Hsiang

AU - Chen, Ting Bin

AU - Pan, Chi Hung

AU - Yang, Yu Shuo

AU - Hwang, Sheng Jye

PY - 2023

Y1 - 2023

N2 - In view of the continuous growth of digital-twin in the technology and industry in recent years, this study conducted the digital mapping of the underfill dispensing process through experiment and simulation to understand and solve the void problem that frequently occurred in flip-chip packaging.

AB - In view of the continuous growth of digital-twin in the technology and industry in recent years, this study conducted the digital mapping of the underfill dispensing process through experiment and simulation to understand and solve the void problem that frequently occurred in flip-chip packaging.

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DO - 10.23919/ICEP58572.2023.10129757

M3 - Conference contribution

AN - SCOPUS:85161930686

T3 - 2023 International Conference on Electronics Packaging, ICEP 2023

SP - 115

EP - 116

BT - 2023 International Conference on Electronics Packaging, ICEP 2023

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 22nd International Conference on Electronics Packaging, ICEP 2023

Y2 - 19 April 2023 through 22 April 2023

ER -

Chen DL, Chang HJ, Chen TY, Hu YH, Chen TB, Pan CH et al. A Study of Underfill Dispensing Patterns in Flip-Chip Packaging. In 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 115-116. (2023 International Conference on Electronics Packaging, ICEP 2023). doi: 10.23919/ICEP58572.2023.10129757

A Study of Underfill Dispensing Patterns in Flip-Chip Packaging

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