Abstract
The resist adhesion property of PECVD deposited hexamethyldisiloxane (HMDSO) films and related footing issues at the resist/BARC interface are evaluated. Larger work of adhesion between HMDSO films and photoresists and smaller stresses of coated HMDSO films are shown with higher O2/HMDSO flow rate ratios. The adhesion property of HMDSO films is significantly enhanced by applying O2 plasma treatment. No footing is found in resist profiles, which is consistent with the measurement result of thermal desorbing.
Original language | English |
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Article number | S0167-9317(01)00501-9 |
Pages (from-to) | 555-561 |
Number of pages | 7 |
Journal | Microelectronic Engineering |
Volume | 57-58 |
DOIs | |
Publication status | Published - 2001 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering