A study on annealing mechanisms with different manganese contents in CuMn alloy

Chia Yang Wu, Chi Ting Wu, Wen Hsi Lee, Shih Chieh Chang, Ying Lang Wang

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)

Abstract

In this paper, the effect of Mn in the CuMn alloy was investigated. And an optimized concentration of Mn in CuMn alloy used as barrier layers was also determined. The electrical and material properties of Copper (Cu) (0.1-10 at.% Mn) alloy and pure Cu films deposited on silicon oxide (SiO 2)/silicon (Si) are researched. A diffusion barrier layer was self-formed at the interface during annealing, and the growth behavior followed a logarithmic rate law. The microstructures of the Cu-Mn films were analyzed by transmission electron microscopy (TEM), and then correlated with the electrical properties of the Cu-Mn films. After annealing, several Cu alloys and pure Cu films appeared to aggregate and the resistance of the films increased. The Cu atoms diffused into the dielectric layers after annealing at 500 °C under vacuum condition. However, no agglomeration and Cu were found in the SiO 2 layer using Cu-Mn alloy with an appropriate amount of Mn, suggesting that a MnSi xO y layer is a suitable barrier for Cu. In the experiment, we found that Mn concentration is one of the key factors in the semiconductor process, and the Cu-5 at.% Mn film demonstrates the best barrier properties.

Original languageEnglish
Pages (from-to)118-123
Number of pages6
JournalJournal of Alloys and Compounds
Volume542
DOIs
Publication statusPublished - 2012 Nov 25

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

Fingerprint Dive into the research topics of 'A study on annealing mechanisms with different manganese contents in CuMn alloy'. Together they form a unique fingerprint.

Cite this