A Tangle-based high performance architecture for large scale IoT solutions

Tsung Fu Chiang, Shih Yeh Chen, Chin Feng Lai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

With the development of science and technology, the use of the IoT has become increasingly widespread [1]. At the same time, the number of IoT devices is also growing at an exponential rate. But, many problems arise that need to be solved, including the security, flexibility, and extensibility of the IoT network and its data. To this end, we hope to strengthen the security and flexibility of networking by using the concept of virtual currency. But connecting to the virtual currency network will cause a lot of time consumption and extra costs. To reduce these additional costs, we designed two architectures and analyze them in the experiment at the end.

Original languageEnglish
Title of host publicationProceedings - 2018 1st International Cognitive Cities Conference, IC3 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages12-15
Number of pages4
ISBN (Electronic)9781538650592
DOIs
Publication statusPublished - 2018 Dec 6
Event1st International Cognitive Cities Conference, IC3 2018 - Okinawa, Japan
Duration: 2018 Aug 72018 Aug 9

Publication series

NameProceedings - 2018 1st International Cognitive Cities Conference, IC3 2018

Other

Other1st International Cognitive Cities Conference, IC3 2018
CountryJapan
CityOkinawa
Period18-08-0718-08-09

All Science Journal Classification (ASJC) codes

  • Artificial Intelligence
  • Computer Networks and Communications
  • Computer Science Applications
  • Education
  • Urban Studies

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  • Cite this

    Chiang, T. F., Chen, S. Y., & Lai, C. F. (2018). A Tangle-based high performance architecture for large scale IoT solutions. In Proceedings - 2018 1st International Cognitive Cities Conference, IC3 2018 (pp. 12-15). [8567158] (Proceedings - 2018 1st International Cognitive Cities Conference, IC3 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IC3.2018.00012