TY - GEN
T1 - A Transparent Big Data Storage Facility (Demo Abstract)
AU - Hsiao, Hung Chang
AU - Lin, Chia Wei
AU - Tsai, Chia Ping
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019
Y1 - 2019
N2 - We present an infrastructural, big data storage facility for Taiwan's semiconductor manufacturing industry. The service, named transparent data storage (TDS), has been built for operating in production systems. It evolves over time by incrementally accommodating users' requirements, and tailors to Taiwan's semiconductor manufacturing industry such as wafer fabrication foundry and IC packaging/test. Specifically, TDS is a RESTful, distributed big data storage facility. Users simply rely on TDS to access data objects stored in Hadoop with RESTful APIs. In addition, TDS is scalable and reliable. Moreover, TDS is efficient and effective by intelligently selecting either Hadoop distributed file system (HDFS) or database (HBase) for publishing data objects. This demo paper demonstrates the design and implementation features for TDS.
AB - We present an infrastructural, big data storage facility for Taiwan's semiconductor manufacturing industry. The service, named transparent data storage (TDS), has been built for operating in production systems. It evolves over time by incrementally accommodating users' requirements, and tailors to Taiwan's semiconductor manufacturing industry such as wafer fabrication foundry and IC packaging/test. Specifically, TDS is a RESTful, distributed big data storage facility. Users simply rely on TDS to access data objects stored in Hadoop with RESTful APIs. In addition, TDS is scalable and reliable. Moreover, TDS is efficient and effective by intelligently selecting either Hadoop distributed file system (HDFS) or database (HBase) for publishing data objects. This demo paper demonstrates the design and implementation features for TDS.
UR - http://www.scopus.com/inward/record.url?scp=85205312584&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85205312584&partnerID=8YFLogxK
U2 - 10.1109/DataCom.2019.00050
DO - 10.1109/DataCom.2019.00050
M3 - Conference contribution
AN - SCOPUS:85205312584
T3 - Proceedings - 2019 IEEE 5th International Conference on Big Data Intelligence and Computing, DataCom 2019
SP - 266
EP - 268
BT - Proceedings - 2019 IEEE 5th International Conference on Big Data Intelligence and Computing, DataCom 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 5th IEEE International Conference on Big Data Intelligence and Computing, DataCom 2019
Y2 - 18 November 2019 through 21 November 2019
ER -