A two-dimensional simulation model for the molded underfill process in flip chip packaging

Xue Ru Guo, Wen Bin Young

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

The flip chip process involves the deposition of solder bumps on the chip surface and their subsequent direct attachment and connection to a substrate. Underfilling traditional flip chip packaging is typically performed following a two-step approach. The first step uses capillary force to fill the gap between the chip and the substrate, and the second step uses epoxy molding compound (EMC) to overmold the package. Unlike traditional flip chip packaging, the molded underfill (MUF) concept uses a single-step approach to simultaneously achieve both underfill and overmold. MUF is a simpler and faster process. In this study, a 2D numerical model is developed to simulate the front movement of EMC flow and the void formation for different geometric parameters. The 2D model simplifies the procedures of geometric modeling and reduces the modeling time for the MUF simulation. Experiments are conducted to verify the prediction results of the model. The effect on void formation for different geometric parameters is investigated using a 2D model.

Original languageEnglish
Pages (from-to)2967-2974
Number of pages8
JournalJournal of Mechanical Science and Technology
Volume29
Issue number7
DOIs
Publication statusPublished - 2015 Jul 23

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering

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