A viscoplastic-based fatigue reliability model for the polyimide dielectric thin film

Yu Chen Chang, Tz Cheng Chiu, Yu Ting Yang, Yi Hsiu Tseng, Xi Hong Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study the fatigue characteristics of polyimide thin film used in redistribution interconnects were considered. Cyclic tension tests under various stress-and strain-ranges were performed to investigate the damage accumulation in the thin film. It was observed that, under cyclic strain loading, the deformation of the thin film is mainly governed by viscoelastic stress relaxation behavior, and damage of the thin film is insignificant. On the other hand, the thin film under cyclic stress loading exhibits a viscoplastic ratcheting response. Furthermore, the envelope of the strain response under stress-controlled cycling increases as the fatigue cycle increases. A phenomenological model was developed for characterizing the damage accumulation under cyclic stress condition. The model considers the viscoplastic response by superpositioning a power-law plastic model and a linear viscoelastic model for predicting the growth of the strain envelope. The fatigue prediction model can be applied for predicting the fatigue failure of the polyimide dielectric in the redistribution interconnects.

Original languageEnglish
Title of host publicationProceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1359-1365
Number of pages7
ISBN (Electronic)9781728114989
DOIs
Publication statusPublished - 2019 May
Event69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States
Duration: 2019 May 282019 May 31

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2019-May
ISSN (Print)0569-5503

Conference

Conference69th IEEE Electronic Components and Technology Conference, ECTC 2019
CountryUnited States
CityLas Vegas
Period19-05-2819-05-31

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Chang, Y. C., Chiu, T. C., Yang, Y. T., Tseng, Y. H., & Chen, X. H. (2019). A viscoplastic-based fatigue reliability model for the polyimide dielectric thin film. In Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019 (pp. 1359-1365). [8811235] (Proceedings - Electronic Components and Technology Conference; Vol. 2019-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2019.00210