Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions

Shih-kang Lin, Kuen Da Chen, Hao Chen, Wei Kai Liou, Yee Wen Yen

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

The interfacial reactions in Sn-0.7wt%Cu/ENIG SUS304 couples at 240, 255, and 270°C are examined in this study. The Ni-containing ternary Cu 6Sn5 phase is formed at the Ni/liquid interface in the early reaction stage then it detaches massively from the SUS304 substrate and splits into two layers in the molten solder as the reaction time increases. This phase finally disintegrates and disappears. The square pillar-shaped FeSn2 phase is found on top of the SUS304 substrate when the Cu6Sn 5 layer detaches. The reaction phase formation, detachment, and split mechanisms are proposed. The spalling phenomenon is reviewed and discussed. The growth mechanism of the FeSn2 phase obeys the parabolic law, and the activation energy is determined to be 112.5 KJ/mol.

Original languageEnglish
Pages (from-to)2278-2286
Number of pages9
JournalJournal of Materials Research
Volume25
Issue number12
DOIs
Publication statusPublished - 2010 Dec 1

Fingerprint

spalling
Spalling
Surface chemistry
Substrates
Soldering alloys
Molten materials
Activation energy
solders
detachment
reaction time
Liquids
activation energy
liquids

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Lin, Shih-kang ; Chen, Kuen Da ; Chen, Hao ; Liou, Wei Kai ; Yen, Yee Wen. / Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions. In: Journal of Materials Research. 2010 ; Vol. 25, No. 12. pp. 2278-2286.
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Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions. / Lin, Shih-kang; Chen, Kuen Da; Chen, Hao; Liou, Wei Kai; Yen, Yee Wen.

In: Journal of Materials Research, Vol. 25, No. 12, 01.12.2010, p. 2278-2286.

Research output: Contribution to journalArticle

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AU - Lin, Shih-kang

AU - Chen, Kuen Da

AU - Chen, Hao

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AU - Yen, Yee Wen

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AB - The interfacial reactions in Sn-0.7wt%Cu/ENIG SUS304 couples at 240, 255, and 270°C are examined in this study. The Ni-containing ternary Cu 6Sn5 phase is formed at the Ni/liquid interface in the early reaction stage then it detaches massively from the SUS304 substrate and splits into two layers in the molten solder as the reaction time increases. This phase finally disintegrates and disappears. The square pillar-shaped FeSn2 phase is found on top of the SUS304 substrate when the Cu6Sn 5 layer detaches. The reaction phase formation, detachment, and split mechanisms are proposed. The spalling phenomenon is reviewed and discussed. The growth mechanism of the FeSn2 phase obeys the parabolic law, and the activation energy is determined to be 112.5 KJ/mol.

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