Abrasion and dissolution interaction of Al in a phosphoric acid solution

Wen Ta Tsai, Tsung Min Huang

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)


By employing a rotating cylinder system, the roles of mechanical abrasion and electrochemical dissolution during Al CMP were studied. Under rotating and abrasive conditions, both the total metal removal rate and the electrochemical dissolution rate of Al in 5 vol.% phosphoric acid+0.5 M citric acid solution (pH 4) increased with an increase in both contact pressure and specimen rotation speed. However, the contribution of electrochemical dissolution to the total removal rate of Al was less than that of mechanical abrasion with a contact force in the range of 0.98-4.90 N. After the abrasive test, metallic Al was present in the solution, indicating that passive film was not the sole material removed under the chemical-mechanical abrasion condition.

Original languageEnglish
Pages (from-to)107-113
Number of pages7
JournalThin Solid Films
Issue number1-2
Publication statusPublished - 2000 Dec 8

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry


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