Abrasive distribution of the fixed diamond wire in wire sawing process

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Fixed diamond wire saw has the advantages such as higher cutting rate and clearer operating environment over the slurry wire saw in wafering. However, the higher cost and poor sliced wafer surface are still the obstacles for the diamond wire saw to totally replace slurry wire saw. In this study, the distribution of diamond grits on the wire was investigated by numerical simulation. The results show that there is a critical value of the abrasive interval to transfer the machining mechanism from plastic plowing to brittle indentation cracking for the material removal. The value depends on both the wire tension and bow angle during the operation.

Original languageEnglish
Title of host publicationAdvanced Manufacturing Focusing on Multi-Disciplinary Technologies
Pages145-152
Number of pages8
DOIs
Publication statusPublished - 2012
Event4th International Conference on Advanced Manufacturing, ICAM 2012 - Jiaoxi, Taiwan
Duration: 2012 Mar 42012 Mar 8

Publication series

NameAdvanced Materials Research
Volume579
ISSN (Print)1022-6680

Other

Other4th International Conference on Advanced Manufacturing, ICAM 2012
CountryTaiwan
CityJiaoxi
Period12-03-0412-03-08

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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