Accelerated recrystallization in electrodeposited dual-layer copper thin films

N. Alshwawreh; M. Militzer; D. Bizzotto; Jui-Chao Kuo

doi:10.1149/2.029312jes

Accelerated recrystallization in electrodeposited dual-layer copper thin films

N. Alshwawreh, M. Militzer, D. Bizzotto, Jui-Chao Kuo

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

Recrystallization was studied in 1 μm-thick Cu films electrodeposited using a two-stage strategy. In each stage, the film was deposited at either low or high current density. The effect of varying the thickness of the layer deposited at high current density on the recrystallization rate was investigated. The recrystallization kinetics were determined using resistivity and electron back-scatter diffraction (EBSD) techniques. Recrystallization rate increases with the thickness of the layer deposited at high current density independent of the order of deposition.

Original language	English
Journal	Journal of the Electrochemical Society
Volume	160
Issue number	12
DOIs	https://doi.org/10.1149/2.029312jes
Publication status	Published - 2013

All Science Journal Classification (ASJC) codes

Electrochemistry
Electronic, Optical and Magnetic Materials
Materials Chemistry
Surfaces, Coatings and Films
Renewable Energy, Sustainability and the Environment
Condensed Matter Physics

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abstract = "Recrystallization was studied in 1 μm-thick Cu films electrodeposited using a two-stage strategy. In each stage, the film was deposited at either low or high current density. The effect of varying the thickness of the layer deposited at high current density on the recrystallization rate was investigated. The recrystallization kinetics were determined using resistivity and electron back-scatter diffraction (EBSD) techniques. Recrystallization rate increases with the thickness of the layer deposited at high current density independent of the order of deposition.",

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AU - Alshwawreh, N.

AU - Militzer, M.

AU - Bizzotto, D.

AU - Kuo, Jui-Chao

PY - 2013

Y1 - 2013

N2 - Recrystallization was studied in 1 μm-thick Cu films electrodeposited using a two-stage strategy. In each stage, the film was deposited at either low or high current density. The effect of varying the thickness of the layer deposited at high current density on the recrystallization rate was investigated. The recrystallization kinetics were determined using resistivity and electron back-scatter diffraction (EBSD) techniques. Recrystallization rate increases with the thickness of the layer deposited at high current density independent of the order of deposition.

AB - Recrystallization was studied in 1 μm-thick Cu films electrodeposited using a two-stage strategy. In each stage, the film was deposited at either low or high current density. The effect of varying the thickness of the layer deposited at high current density on the recrystallization rate was investigated. The recrystallization kinetics were determined using resistivity and electron back-scatter diffraction (EBSD) techniques. Recrystallization rate increases with the thickness of the layer deposited at high current density independent of the order of deposition.

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ER -

Accelerated recrystallization in electrodeposited dual-layer copper thin films

Abstract

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