ACCOUSTIC EMISSION SENSOR PROBE AND METHOD FOR COMBINATION OF PIEZOELECTRIC MATERIALS OF ACOUSTIC EMISSION PROBE AND ACOUSTIC IMPEDANCE MATCHING LAYER

Jiann-Fuh Chen (Inventor), Cheng-Chi Tai (Inventor)

Research output: Patent

Abstract

本發明係有關於一種音射探頭及其壓電材料與音阻抗匹配層的結合方法,係將至少一經極化後的壓電材料結合於音阻抗匹配層上,結合時是先將音阻抗匹配層加熱至一預設溫度,並將銲料置於音阻抗匹配層上,使之受熱而熔融,待將壓電材料置於其上後,便能使極化後之壓電材料密貼結合於音阻抗匹配層上;而透過此種結合方式,能避免經極化後之壓電材料的電子排列錯亂,進而提升音射探頭之偵測靈敏度。
Original languageEnglish
Patent numberI472760
Publication statusPublished - 1800

Cite this

@misc{5daff129a93d4547933746e56f8fb8b2,
title = "ACCOUSTIC EMISSION SENSOR PROBE AND METHOD FOR COMBINATION OF PIEZOELECTRIC MATERIALS OF ACOUSTIC EMISSION PROBE AND ACOUSTIC IMPEDANCE MATCHING LAYER",
abstract = "本發明係有關於一種音射探頭及其壓電材料與音阻抗匹配層的結合方法,係將至少一經極化後的壓電材料結合於音阻抗匹配層上,結合時是先將音阻抗匹配層加熱至一預設溫度,並將銲料置於音阻抗匹配層上,使之受熱而熔融,待將壓電材料置於其上後,便能使極化後之壓電材料密貼結合於音阻抗匹配層上;而透過此種結合方式,能避免經極化後之壓電材料的電子排列錯亂,進而提升音射探頭之偵測靈敏度。",
author = "Jiann-Fuh Chen and Cheng-Chi Tai",
year = "1800",
language = "English",
type = "Patent",
note = "I472760",

}

TY - PAT

T1 - ACCOUSTIC EMISSION SENSOR PROBE AND METHOD FOR COMBINATION OF PIEZOELECTRIC MATERIALS OF ACOUSTIC EMISSION PROBE AND ACOUSTIC IMPEDANCE MATCHING LAYER

AU - Chen, Jiann-Fuh

AU - Tai, Cheng-Chi

PY - 1800

Y1 - 1800

N2 - 本發明係有關於一種音射探頭及其壓電材料與音阻抗匹配層的結合方法,係將至少一經極化後的壓電材料結合於音阻抗匹配層上,結合時是先將音阻抗匹配層加熱至一預設溫度,並將銲料置於音阻抗匹配層上,使之受熱而熔融,待將壓電材料置於其上後,便能使極化後之壓電材料密貼結合於音阻抗匹配層上;而透過此種結合方式,能避免經極化後之壓電材料的電子排列錯亂,進而提升音射探頭之偵測靈敏度。

AB - 本發明係有關於一種音射探頭及其壓電材料與音阻抗匹配層的結合方法,係將至少一經極化後的壓電材料結合於音阻抗匹配層上,結合時是先將音阻抗匹配層加熱至一預設溫度,並將銲料置於音阻抗匹配層上,使之受熱而熔融,待將壓電材料置於其上後,便能使極化後之壓電材料密貼結合於音阻抗匹配層上;而透過此種結合方式,能避免經極化後之壓電材料的電子排列錯亂,進而提升音射探頭之偵測靈敏度。

M3 - Patent

M1 - I472760

ER -