Adhesion of multilayer solder pads on silicon

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Abstract

Adhesion strengths of Al/Mo/Ni and Al/Zn/Ni-P multilayers on silicon were investigated with a pull test. Attempts were made to investigate the adhesion strengths of the structures on silicon for the Al unilayer, Al/Mo and Al/Zn bilayers, and Al/Mo/Ni and Al/Zn/Ni-P trilayers. Analysis of the fracture surface clearly revealed the effect of additional layers on the adhesion strengths of the Al deposit. The sputter-deposited Ni layer and the electrolessly deposited Ni-P layer tend to suppress the adhesion strength of the Al/Si. The zincating deposition may compensate for the negative effect of the Ni-P deposit on the adhesion strength of Al/Sl.

Original languageEnglish
Pages (from-to)253-257
Number of pages5
JournalJournal of Materials Science: Materials in Electronics
Volume8
Issue number4
DOIs
Publication statusPublished - 1997 Jan 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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