Adsorption and desorption of bis-(3-sulfopropyl) disulfide during cu electrodeposition and stripping at Au electrodes

Yong Da Chiu, Wei Ping Dow, Klaus Krug, Yung Fang Liu, Yuh-Lang Lee, Shueh Lin Yau

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

The adsorption and desorption of bis-(3-sulfopropyl) disulfide (SPS) on Cu and Au electrodes and its electrochemical effect on Cu deposition and dissolution were examined using cyclic voltammetry stripping (CVS), field-emission scanning electron microscopy (FESEM), and X-ray photoelectron spectroscopy (XPS). SPS dissociates into 3-mercapto-1-propanesulfonate when it is contacted with Au and Cu electrodes, producing Cu(I)- and Au(I)-thiolate species. These thiolates couple with chloride ions and promote not only the reduction of Cu 2+ in Cu deposition but also the oxidation of Cu 0 to Cu + in Cu stripping. During Cu electrodeposition on the SPS-modified Au electrode, thiolates transfer from Au onto the Cu underpotential deposition (UPD) layer. The Cu UPD layer stabilizes a large part of the transferred thiolates which subsequently is buried by the Cu overpotential deposition (OPD) layer. The buried thiolates reappear on the Au electrode after the copper deposit is electrochemically stripped off. A much smaller part of thiolates transfers to the top of the Cu OPD layer. In contrast, when SPS preadsorbs on a Cu-coated Au electrode, almost all of the adsorbed SPS leaves the Cu surface during Cu electrochemical stripping and does not return to the uncovered Au surface. A reaction mechanism is proposed to explain these results.

Original languageEnglish
Pages (from-to)14476-14487
Number of pages12
JournalLangmuir
Volume28
Issue number40
DOIs
Publication statusPublished - 2012 Oct 9

Fingerprint

disulfides
stripping
Electrodeposition
electrodeposition
Disulfides
Desorption
desorption
Adsorption
Electrodes
adsorption
electrodes
Copper deposits
Field emission
leaves
Cyclic voltammetry
Chlorides
field emission
dissolving
Dissolution
X ray photoelectron spectroscopy

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry

Cite this

Chiu, Yong Da ; Dow, Wei Ping ; Krug, Klaus ; Liu, Yung Fang ; Lee, Yuh-Lang ; Yau, Shueh Lin. / Adsorption and desorption of bis-(3-sulfopropyl) disulfide during cu electrodeposition and stripping at Au electrodes. In: Langmuir. 2012 ; Vol. 28, No. 40. pp. 14476-14487.
@article{5ce9909dde2c4f6a9d561fb1c4df16cc,
title = "Adsorption and desorption of bis-(3-sulfopropyl) disulfide during cu electrodeposition and stripping at Au electrodes",
abstract = "The adsorption and desorption of bis-(3-sulfopropyl) disulfide (SPS) on Cu and Au electrodes and its electrochemical effect on Cu deposition and dissolution were examined using cyclic voltammetry stripping (CVS), field-emission scanning electron microscopy (FESEM), and X-ray photoelectron spectroscopy (XPS). SPS dissociates into 3-mercapto-1-propanesulfonate when it is contacted with Au and Cu electrodes, producing Cu(I)- and Au(I)-thiolate species. These thiolates couple with chloride ions and promote not only the reduction of Cu 2+ in Cu deposition but also the oxidation of Cu 0 to Cu + in Cu stripping. During Cu electrodeposition on the SPS-modified Au electrode, thiolates transfer from Au onto the Cu underpotential deposition (UPD) layer. The Cu UPD layer stabilizes a large part of the transferred thiolates which subsequently is buried by the Cu overpotential deposition (OPD) layer. The buried thiolates reappear on the Au electrode after the copper deposit is electrochemically stripped off. A much smaller part of thiolates transfers to the top of the Cu OPD layer. In contrast, when SPS preadsorbs on a Cu-coated Au electrode, almost all of the adsorbed SPS leaves the Cu surface during Cu electrochemical stripping and does not return to the uncovered Au surface. A reaction mechanism is proposed to explain these results.",
author = "Chiu, {Yong Da} and Dow, {Wei Ping} and Klaus Krug and Liu, {Yung Fang} and Yuh-Lang Lee and Yau, {Shueh Lin}",
year = "2012",
month = "10",
day = "9",
doi = "10.1021/la3025183",
language = "English",
volume = "28",
pages = "14476--14487",
journal = "Langmuir",
issn = "0743-7463",
publisher = "American Chemical Society",
number = "40",

}

Adsorption and desorption of bis-(3-sulfopropyl) disulfide during cu electrodeposition and stripping at Au electrodes. / Chiu, Yong Da; Dow, Wei Ping; Krug, Klaus; Liu, Yung Fang; Lee, Yuh-Lang; Yau, Shueh Lin.

In: Langmuir, Vol. 28, No. 40, 09.10.2012, p. 14476-14487.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Adsorption and desorption of bis-(3-sulfopropyl) disulfide during cu electrodeposition and stripping at Au electrodes

AU - Chiu, Yong Da

AU - Dow, Wei Ping

AU - Krug, Klaus

AU - Liu, Yung Fang

AU - Lee, Yuh-Lang

AU - Yau, Shueh Lin

PY - 2012/10/9

Y1 - 2012/10/9

N2 - The adsorption and desorption of bis-(3-sulfopropyl) disulfide (SPS) on Cu and Au electrodes and its electrochemical effect on Cu deposition and dissolution were examined using cyclic voltammetry stripping (CVS), field-emission scanning electron microscopy (FESEM), and X-ray photoelectron spectroscopy (XPS). SPS dissociates into 3-mercapto-1-propanesulfonate when it is contacted with Au and Cu electrodes, producing Cu(I)- and Au(I)-thiolate species. These thiolates couple with chloride ions and promote not only the reduction of Cu 2+ in Cu deposition but also the oxidation of Cu 0 to Cu + in Cu stripping. During Cu electrodeposition on the SPS-modified Au electrode, thiolates transfer from Au onto the Cu underpotential deposition (UPD) layer. The Cu UPD layer stabilizes a large part of the transferred thiolates which subsequently is buried by the Cu overpotential deposition (OPD) layer. The buried thiolates reappear on the Au electrode after the copper deposit is electrochemically stripped off. A much smaller part of thiolates transfers to the top of the Cu OPD layer. In contrast, when SPS preadsorbs on a Cu-coated Au electrode, almost all of the adsorbed SPS leaves the Cu surface during Cu electrochemical stripping and does not return to the uncovered Au surface. A reaction mechanism is proposed to explain these results.

AB - The adsorption and desorption of bis-(3-sulfopropyl) disulfide (SPS) on Cu and Au electrodes and its electrochemical effect on Cu deposition and dissolution were examined using cyclic voltammetry stripping (CVS), field-emission scanning electron microscopy (FESEM), and X-ray photoelectron spectroscopy (XPS). SPS dissociates into 3-mercapto-1-propanesulfonate when it is contacted with Au and Cu electrodes, producing Cu(I)- and Au(I)-thiolate species. These thiolates couple with chloride ions and promote not only the reduction of Cu 2+ in Cu deposition but also the oxidation of Cu 0 to Cu + in Cu stripping. During Cu electrodeposition on the SPS-modified Au electrode, thiolates transfer from Au onto the Cu underpotential deposition (UPD) layer. The Cu UPD layer stabilizes a large part of the transferred thiolates which subsequently is buried by the Cu overpotential deposition (OPD) layer. The buried thiolates reappear on the Au electrode after the copper deposit is electrochemically stripped off. A much smaller part of thiolates transfers to the top of the Cu OPD layer. In contrast, when SPS preadsorbs on a Cu-coated Au electrode, almost all of the adsorbed SPS leaves the Cu surface during Cu electrochemical stripping and does not return to the uncovered Au surface. A reaction mechanism is proposed to explain these results.

UR - http://www.scopus.com/inward/record.url?scp=84867481042&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84867481042&partnerID=8YFLogxK

U2 - 10.1021/la3025183

DO - 10.1021/la3025183

M3 - Article

VL - 28

SP - 14476

EP - 14487

JO - Langmuir

JF - Langmuir

SN - 0743-7463

IS - 40

ER -