Advanced Electronic Interconnection

Shih kang Lin

doi:10.1007/s11837-019-03660-z

Advanced Electronic Interconnection

Shih kang Lin

Department of Materials Science and Engineering

Research output: Contribution to journal › Comment/debate › peer-review

1 Citation (Scopus)

Original language	English
Pages (from-to)	2996-2997
Number of pages	2
Journal	JOM
Volume	71
Issue number	9
DOIs	https://doi.org/10.1007/s11837-019-03660-z
Publication status	Published - 2019 Sept 15

All Science Journal Classification (ASJC) codes

General Materials Science
General Engineering

Access to Document

10.1007/s11837-019-03660-z

Cite this

@article{96fe5863bbd94ce6bc3819298c3c3e16,

title = "Advanced Electronic Interconnection",

author = "Lin, {Shih kang}",

year = "2019",

month = sep,

day = "15",

doi = "10.1007/s11837-019-03660-z",

language = "English",

volume = "71",

pages = "2996--2997",

journal = "JOM",

issn = "1047-4838",

publisher = "Minerals, Metals and Materials Society",

number = "9",

}

TY - JOUR

T1 - Advanced Electronic Interconnection

AU - Lin, Shih kang

PY - 2019/9/15

Y1 - 2019/9/15

UR - http://www.scopus.com/inward/record.url?scp=85070848808&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85070848808&partnerID=8YFLogxK

U2 - 10.1007/s11837-019-03660-z

DO - 10.1007/s11837-019-03660-z

M3 - Comment/debate

AN - SCOPUS:85070848808

SN - 1047-4838

VL - 71

SP - 2996

EP - 2997

JO - JOM

JF - JOM

IS - 9

ER -

Advanced Electronic Interconnection

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Cite this