AgCrO                         2                          formation mechanism during silver inner electrode and Fe–Si–Cr alloy powder co-firing in metal multilayer chip power inductors

Yung Ping Wu; Hsin Yun Chiang; Hsing I. Hsiang

doi:10.1007/s10854-019-01130-5

AgCrO ₂ formation mechanism during silver inner electrode and Fe–Si–Cr alloy powder co-firing in metal multilayer chip power inductors

Yung Ping Wu, Hsin Yun Chiang, Hsing I. Hsiang

Department of Resources Engineering

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

Multilayer Fe–Si–Cr alloy chip power inductors have the benefits of a smaller, thinner profile, lower DC resistance and higher rated current. During metal multilayer power inductor co-firing, Fe–Si–Cr alloy powders react with the inner electrode, silver, to form a large amount of hexagonal flaky AgCrO ₂ . The p-type semiconductor, AgCrO ₂ , will cause co-fired Fe–Si–Cr alloy multilayer chip power inductor insulation degradation, hence reducing the power conversion efficiency due to the increase in eddy current loss. The AgCrO ₂ forming mechanism is investigated in this study. It was observed that silver reacts with the Fe–Si–Cr thermal grown oxide layer, Cr ₂ O ₃ , and subsequently leads to the formation of Ag ₂ CrO ₄ when the temperature is lower than 650 °C. The formed Ag ₂ CrO ₄ with low melting temperature then volatilizes at higher temperatures through the pore channels to react with the volatilized Cr ₂ O ₃ to form the AgCrO ₂ . AgCrO ₂ will cause Fe–Si–Cr alloy multilayer chip inductor resistivity and breakdown voltage degradation.

Original language	English
Journal	Journal of Materials Science: Materials in Electronics
DOIs	https://doi.org/10.1007/s10854-019-01130-5
Publication status	Published - 2019 Jan 1

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Electrical and Electronic Engineering

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Wu, Y. P., Chiang, H. Y., & Hsiang, H. I. (2019). AgCrO ₂ formation mechanism during silver inner electrode and Fe–Si–Cr alloy powder co-firing in metal multilayer chip power inductors Journal of Materials Science: Materials in Electronics. https://doi.org/10.1007/s10854-019-01130-5

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title = " AgCrO 2 formation mechanism during silver inner electrode and Fe–Si–Cr alloy powder co-firing in metal multilayer chip power inductors ",

abstract = " Multilayer Fe–Si–Cr alloy chip power inductors have the benefits of a smaller, thinner profile, lower DC resistance and higher rated current. During metal multilayer power inductor co-firing, Fe–Si–Cr alloy powders react with the inner electrode, silver, to form a large amount of hexagonal flaky AgCrO 2 . The p-type semiconductor, AgCrO 2 , will cause co-fired Fe–Si–Cr alloy multilayer chip power inductor insulation degradation, hence reducing the power conversion efficiency due to the increase in eddy current loss. The AgCrO 2 forming mechanism is investigated in this study. It was observed that silver reacts with the Fe–Si–Cr thermal grown oxide layer, Cr 2 O 3 , and subsequently leads to the formation of Ag 2 CrO 4 when the temperature is lower than 650 °C. The formed Ag 2 CrO 4 with low melting temperature then volatilizes at higher temperatures through the pore channels to react with the volatilized Cr 2 O 3 to form the AgCrO 2 . AgCrO 2 will cause Fe–Si–Cr alloy multilayer chip inductor resistivity and breakdown voltage degradation. ",

author = "Wu, {Yung Ping} and Chiang, {Hsin Yun} and Hsiang, {Hsing I.}",

year = "2019",

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Wu, YP, Chiang, HY & Hsiang, HI 2019, ' AgCrO ₂ formation mechanism during silver inner electrode and Fe–Si–Cr alloy powder co-firing in metal multilayer chip power inductors ', Journal of Materials Science: Materials in Electronics. https://doi.org/10.1007/s10854-019-01130-5

AgCrO ₂ formation mechanism during silver inner electrode and Fe–Si–Cr alloy powder co-firing in metal multilayer chip power inductors . / Wu, Yung Ping; Chiang, Hsin Yun; Hsiang, Hsing I.

In: Journal of Materials Science: Materials in Electronics, 01.01.2019.

Research output: Contribution to journal › Article › peer-review

TY - JOUR

T1 - AgCrO 2 formation mechanism during silver inner electrode and Fe–Si–Cr alloy powder co-firing in metal multilayer chip power inductors

AU - Wu, Yung Ping

AU - Chiang, Hsin Yun

AU - Hsiang, Hsing I.

PY - 2019/1/1

Y1 - 2019/1/1

N2 - Multilayer Fe–Si–Cr alloy chip power inductors have the benefits of a smaller, thinner profile, lower DC resistance and higher rated current. During metal multilayer power inductor co-firing, Fe–Si–Cr alloy powders react with the inner electrode, silver, to form a large amount of hexagonal flaky AgCrO 2 . The p-type semiconductor, AgCrO 2 , will cause co-fired Fe–Si–Cr alloy multilayer chip power inductor insulation degradation, hence reducing the power conversion efficiency due to the increase in eddy current loss. The AgCrO 2 forming mechanism is investigated in this study. It was observed that silver reacts with the Fe–Si–Cr thermal grown oxide layer, Cr 2 O 3 , and subsequently leads to the formation of Ag 2 CrO 4 when the temperature is lower than 650 °C. The formed Ag 2 CrO 4 with low melting temperature then volatilizes at higher temperatures through the pore channels to react with the volatilized Cr 2 O 3 to form the AgCrO 2 . AgCrO 2 will cause Fe–Si–Cr alloy multilayer chip inductor resistivity and breakdown voltage degradation.

AB - Multilayer Fe–Si–Cr alloy chip power inductors have the benefits of a smaller, thinner profile, lower DC resistance and higher rated current. During metal multilayer power inductor co-firing, Fe–Si–Cr alloy powders react with the inner electrode, silver, to form a large amount of hexagonal flaky AgCrO 2 . The p-type semiconductor, AgCrO 2 , will cause co-fired Fe–Si–Cr alloy multilayer chip power inductor insulation degradation, hence reducing the power conversion efficiency due to the increase in eddy current loss. The AgCrO 2 forming mechanism is investigated in this study. It was observed that silver reacts with the Fe–Si–Cr thermal grown oxide layer, Cr 2 O 3 , and subsequently leads to the formation of Ag 2 CrO 4 when the temperature is lower than 650 °C. The formed Ag 2 CrO 4 with low melting temperature then volatilizes at higher temperatures through the pore channels to react with the volatilized Cr 2 O 3 to form the AgCrO 2 . AgCrO 2 will cause Fe–Si–Cr alloy multilayer chip inductor resistivity and breakdown voltage degradation.

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Wu YP, Chiang HY, Hsiang HI. AgCrO ₂ formation mechanism during silver inner electrode and Fe–Si–Cr alloy powder co-firing in metal multilayer chip power inductors Journal of Materials Science: Materials in Electronics. 2019 Jan 1. https://doi.org/10.1007/s10854-019-01130-5