AgCrO 2 formation mechanism during silver inner electrode and Fe–Si–Cr alloy powder co-firing in metal multilayer chip power inductors

Yung Ping Wu, Hsin Yun Chiang, Hsing-I Hsiang

Research output: Contribution to journalArticle

Abstract

Multilayer Fe–Si–Cr alloy chip power inductors have the benefits of a smaller, thinner profile, lower DC resistance and higher rated current. During metal multilayer power inductor co-firing, Fe–Si–Cr alloy powders react with the inner electrode, silver, to form a large amount of hexagonal flaky AgCrO 2 . The p-type semiconductor, AgCrO 2 , will cause co-fired Fe–Si–Cr alloy multilayer chip power inductor insulation degradation, hence reducing the power conversion efficiency due to the increase in eddy current loss. The AgCrO 2 forming mechanism is investigated in this study. It was observed that silver reacts with the Fe–Si–Cr thermal grown oxide layer, Cr 2 O 3 , and subsequently leads to the formation of Ag 2 CrO 4 when the temperature is lower than 650 °C. The formed Ag 2 CrO 4 with low melting temperature then volatilizes at higher temperatures through the pore channels to react with the volatilized Cr 2 O 3 to form the AgCrO 2 . AgCrO 2 will cause Fe–Si–Cr alloy multilayer chip inductor resistivity and breakdown voltage degradation.

Original languageEnglish
JournalJournal of Materials Science: Materials in Electronics
DOIs
Publication statusPublished - 2019 Jan 1

Fingerprint

Power inductors
inductors
Silver
Powders
Multilayers
Metals
chips
silver
Electrodes
electrodes
metals
degradation
Degradation
p-type semiconductors
causes
Eddy currents
Electric breakdown
eddy currents
electrical faults
insulation

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

@article{ce64bce826f948cba81ab5797f94ca82,
title = "AgCrO 2 formation mechanism during silver inner electrode and Fe–Si–Cr alloy powder co-firing in metal multilayer chip power inductors",
abstract = "Multilayer Fe–Si–Cr alloy chip power inductors have the benefits of a smaller, thinner profile, lower DC resistance and higher rated current. During metal multilayer power inductor co-firing, Fe–Si–Cr alloy powders react with the inner electrode, silver, to form a large amount of hexagonal flaky AgCrO 2 . The p-type semiconductor, AgCrO 2 , will cause co-fired Fe–Si–Cr alloy multilayer chip power inductor insulation degradation, hence reducing the power conversion efficiency due to the increase in eddy current loss. The AgCrO 2 forming mechanism is investigated in this study. It was observed that silver reacts with the Fe–Si–Cr thermal grown oxide layer, Cr 2 O 3 , and subsequently leads to the formation of Ag 2 CrO 4 when the temperature is lower than 650 °C. The formed Ag 2 CrO 4 with low melting temperature then volatilizes at higher temperatures through the pore channels to react with the volatilized Cr 2 O 3 to form the AgCrO 2 . AgCrO 2 will cause Fe–Si–Cr alloy multilayer chip inductor resistivity and breakdown voltage degradation.",
author = "Wu, {Yung Ping} and Chiang, {Hsin Yun} and Hsing-I Hsiang",
year = "2019",
month = "1",
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doi = "10.1007/s10854-019-01130-5",
language = "English",
journal = "Journal of Materials Science: Materials in Electronics",
issn = "0957-4522",
publisher = "Springer New York",

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AU - Wu, Yung Ping

AU - Chiang, Hsin Yun

AU - Hsiang, Hsing-I

PY - 2019/1/1

Y1 - 2019/1/1

N2 - Multilayer Fe–Si–Cr alloy chip power inductors have the benefits of a smaller, thinner profile, lower DC resistance and higher rated current. During metal multilayer power inductor co-firing, Fe–Si–Cr alloy powders react with the inner electrode, silver, to form a large amount of hexagonal flaky AgCrO 2 . The p-type semiconductor, AgCrO 2 , will cause co-fired Fe–Si–Cr alloy multilayer chip power inductor insulation degradation, hence reducing the power conversion efficiency due to the increase in eddy current loss. The AgCrO 2 forming mechanism is investigated in this study. It was observed that silver reacts with the Fe–Si–Cr thermal grown oxide layer, Cr 2 O 3 , and subsequently leads to the formation of Ag 2 CrO 4 when the temperature is lower than 650 °C. The formed Ag 2 CrO 4 with low melting temperature then volatilizes at higher temperatures through the pore channels to react with the volatilized Cr 2 O 3 to form the AgCrO 2 . AgCrO 2 will cause Fe–Si–Cr alloy multilayer chip inductor resistivity and breakdown voltage degradation.

AB - Multilayer Fe–Si–Cr alloy chip power inductors have the benefits of a smaller, thinner profile, lower DC resistance and higher rated current. During metal multilayer power inductor co-firing, Fe–Si–Cr alloy powders react with the inner electrode, silver, to form a large amount of hexagonal flaky AgCrO 2 . The p-type semiconductor, AgCrO 2 , will cause co-fired Fe–Si–Cr alloy multilayer chip power inductor insulation degradation, hence reducing the power conversion efficiency due to the increase in eddy current loss. The AgCrO 2 forming mechanism is investigated in this study. It was observed that silver reacts with the Fe–Si–Cr thermal grown oxide layer, Cr 2 O 3 , and subsequently leads to the formation of Ag 2 CrO 4 when the temperature is lower than 650 °C. The formed Ag 2 CrO 4 with low melting temperature then volatilizes at higher temperatures through the pore channels to react with the volatilized Cr 2 O 3 to form the AgCrO 2 . AgCrO 2 will cause Fe–Si–Cr alloy multilayer chip inductor resistivity and breakdown voltage degradation.

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