TY - GEN
T1 - AlGaN/AlN/GaN MOS-HEMTs with Al2O3 gate dielectric formed by using ozone water oxidation technique
AU - Lee, C. S.
AU - Liu, H. Y.
AU - Hsu, W. C.
AU - Wu, T. T.
AU - Huang, H. S.
AU - Chen, S. F.
AU - Yang, Y. C.
AU - Chiang, B. C.
AU - Chang, H. C.
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/8/14
Y1 - 2015/8/14
N2 - This work presents Al0.3Ga0.7N/AlN/GaN metal-oxide-semiconductor high electron mobility transistors (MOS-HEMTs), grown on the Si substrate, with high-k Al2O3 gate dielectric. The present AlGaN/AlN/GaN MOS-HEMT design (the control Schottky-gate HEMT) has showed two-terminal gate-drain breakdown voltage (BVGD)/turn-on voltage (Von) of -146.6/1.12 (-96.4/0.98) V, maximum extrinsic transconductance (gm, max) of 167.3 (124.2) mS/mm, saturated IDS density at VGS = 0 V (IDSS0) of 701.4 (538.2) mA/mm, maximum IDS density (IDS, max) of 927.9 (646) mA/mm, AV of 211.8 (172.5), unity-gain cut-off frequency (fT) of 16.8 (11) GHz, maximum oscillation frequency (fmax) of 18.8 (14) GHz, 2.4-GHz output power (Pout) of 17.2 (15.7) dBm, power gain (GS) of 14.1 (13.4) dB, and power-added efficiency (PAE) of 32.2% (27.4%). Consequently, superior improvements of 52.2% in BVGD, 43.6% in IDS, max, 34.7% gm, max, and 52.7%/34.3% in fT/fmax are achieved as compared with a control HEMT device.
AB - This work presents Al0.3Ga0.7N/AlN/GaN metal-oxide-semiconductor high electron mobility transistors (MOS-HEMTs), grown on the Si substrate, with high-k Al2O3 gate dielectric. The present AlGaN/AlN/GaN MOS-HEMT design (the control Schottky-gate HEMT) has showed two-terminal gate-drain breakdown voltage (BVGD)/turn-on voltage (Von) of -146.6/1.12 (-96.4/0.98) V, maximum extrinsic transconductance (gm, max) of 167.3 (124.2) mS/mm, saturated IDS density at VGS = 0 V (IDSS0) of 701.4 (538.2) mA/mm, maximum IDS density (IDS, max) of 927.9 (646) mA/mm, AV of 211.8 (172.5), unity-gain cut-off frequency (fT) of 16.8 (11) GHz, maximum oscillation frequency (fmax) of 18.8 (14) GHz, 2.4-GHz output power (Pout) of 17.2 (15.7) dBm, power gain (GS) of 14.1 (13.4) dB, and power-added efficiency (PAE) of 32.2% (27.4%). Consequently, superior improvements of 52.2% in BVGD, 43.6% in IDS, max, 34.7% gm, max, and 52.7%/34.3% in fT/fmax are achieved as compared with a control HEMT device.
UR - http://www.scopus.com/inward/record.url?scp=84951983937&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84951983937&partnerID=8YFLogxK
U2 - 10.1109/PEDS.2015.7203397
DO - 10.1109/PEDS.2015.7203397
M3 - Conference contribution
AN - SCOPUS:84951983937
T3 - Proceedings of the International Conference on Power Electronics and Drive Systems
SP - 194
EP - 196
BT - 2015 IEEE 11th International Conference on Power Electronics and Drive Systems, PEDS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 11th IEEE International Conference on Power Electronics and Drive Systems, PEDS 2015
Y2 - 9 June 2015 through 12 June 2015
ER -