Amorphous metallic alloys: A new advance in thin-film diffusion barriers for copper metallization

E. Kolawa, J. S. Reid, J. S. Chen

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)11-17
Number of pages7
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume1805
DOIs
Publication statusPublished - 1993 May 21
EventSubmicrometer Metallization: Challenges, Opportunities, and Limitations 1992 - San Jose, United States
Duration: 1992 Sep 201992 Sep 25

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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