Amorphous metallic alloys: A new advance in thin-film diffusion barriers for copper metallization

E. Kolawa; J. S. Reid; J. S. Chen

doi:10.1117/12.145460

Amorphous metallic alloys: A new advance in thin-film diffusion barriers for copper metallization

E. Kolawa
, J. S. Reid
, J. S. Chen

Department of Materials Science and Engineering

Research output: Contribution to journal › Conference article › peer-review

1 Citation (Scopus)

Original language	English
Pages (from-to)	11-17
Number of pages	7
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	1805
DOIs	https://doi.org/10.1117/12.145460
Publication status	Published - 1993 May 21
Event	Submicrometer Metallization: Challenges, Opportunities, and Limitations 1992 - San Jose, United States Duration: 1992 Sept 20 → 1992 Sept 25

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

Access to Document

10.1117/12.145460

Cite this

@article{8af835ffd3394b5ab4e6ac0a621f5b5f,

title = "Amorphous metallic alloys: A new advance in thin-film diffusion barriers for copper metallization",

author = "E. Kolawa and Reid, \{J. S.\} and Chen, \{J. S.\}",

note = "Funding Information: The financial support of the U.S. Army Research Office is gratefully acknowledged. The authors thank Rob Gorris for technical assistance and Rachael Sampley for manuscript preparation. Funding Information: The financial support ofthe U.S. Army Research Office is gratefully acknowledged. The authors thank Rob Gorris for technical assistance and Rachael Sampley for manuscript preparation.; Submicrometer Metallization: Challenges, Opportunities, and Limitations 1992 ; Conference date: 20-09-1992 Through 25-09-1992",

year = "1993",

month = may,

day = "21",

doi = "10.1117/12.145460",

language = "English",

volume = "1805",

pages = "11--17",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

}

TY - JOUR

T1 - Amorphous metallic alloys

T2 - Submicrometer Metallization: Challenges, Opportunities, and Limitations 1992

AU - Kolawa, E.

AU - Reid, J. S.

AU - Chen, J. S.

N1 - Funding Information: The financial support of the U.S. Army Research Office is gratefully acknowledged. The authors thank Rob Gorris for technical assistance and Rachael Sampley for manuscript preparation. Funding Information: The financial support ofthe U.S. Army Research Office is gratefully acknowledged. The authors thank Rob Gorris for technical assistance and Rachael Sampley for manuscript preparation.

PY - 1993/5/21

Y1 - 1993/5/21

UR - https://www.scopus.com/pages/publications/85075778019

UR - https://www.scopus.com/pages/publications/85075778019#tab=citedBy

U2 - 10.1117/12.145460

DO - 10.1117/12.145460

M3 - Conference article

AN - SCOPUS:85075778019

SN - 0277-786X

VL - 1805

SP - 11

EP - 17

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

Y2 - 20 September 1992 through 25 September 1992

ER -

Amorphous metallic alloys: A new advance in thin-film diffusion barriers for copper metallization

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Cite this