An analytical design method for a shape memory alloy wire actuated compliant finger

Chao-Chieh Lan, You Nien Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents an analytical method to design a mechanical finger for robotic manipulations. As traditional mechanical fingers require bulky electro-magnetic motors and numerous relative-moving parts to achieve dexterous motion, we propose a class of fingers the manipulation of which relies on finger deflections. These compliant fingers are actuated by shape memory alloy (SMA) wires that exhibit high workdensity, frictionless, and quite operations. The combination of compliant members with embedded SMA wires makes the finger more compact and lightweight. Various SMA wire layouts are investigated to improve their response time while maintaining sufficient output force. The mathematical models of finger deflection caused by SMA contraction are then derived along with experimental validations. As finger shapes are essential to the range of deflected motion and output force, we find its optimal initial shapes through the use of a shape parameterization technique. We further illustrate our method by designing a humanoid finger that is capable of threedimensional manipulation. As compliant fingers can be fabricated monolithically, we expect the proposed method to be utilized for applications of various scales.

Original languageEnglish
Title of host publication2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008
Pages123-132
Number of pages10
Volume2
EditionPART A
Publication statusPublished - 2009
Event2008 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008 - New York City, NY, United States
Duration: 2008 Aug 32008 Aug 6

Other

Other2008 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008
CountryUnited States
CityNew York City, NY
Period08-08-0308-08-06

Fingerprint

Shape memory effect
Wire
Parameterization
Robotics
Mathematical models

All Science Journal Classification (ASJC) codes

  • Artificial Intelligence
  • Computational Theory and Mathematics
  • Industrial and Manufacturing Engineering
  • Mechanical Engineering

Cite this

Lan, C-C., & Yang, Y. N. (2009). An analytical design method for a shape memory alloy wire actuated compliant finger. In 2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008 (PART A ed., Vol. 2, pp. 123-132)
Lan, Chao-Chieh ; Yang, You Nien. / An analytical design method for a shape memory alloy wire actuated compliant finger. 2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008. Vol. 2 PART A. ed. 2009. pp. 123-132
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Lan, C-C & Yang, YN 2009, An analytical design method for a shape memory alloy wire actuated compliant finger. in 2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008. PART A edn, vol. 2, pp. 123-132, 2008 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008, New York City, NY, United States, 08-08-03.

An analytical design method for a shape memory alloy wire actuated compliant finger. / Lan, Chao-Chieh; Yang, You Nien.

2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008. Vol. 2 PART A. ed. 2009. p. 123-132.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Lan C-C, Yang YN. An analytical design method for a shape memory alloy wire actuated compliant finger. In 2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008. PART A ed. Vol. 2. 2009. p. 123-132