An efficient solution for wire sweep analysis in IC packaging

Jerry Su, Sheng-Jye Hwang, Francis Su, Shou Kang Chen

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

Various methodologies of wire sweep analysis have been introduced to get better prediction and matching the experimental measurements by many researchers. As more and more high pin-count packages (such as BGA, QFP) are used today, efficiency has become an important requirement besides accuracy for software used to predict wire sweep in IC packaging. This study introduces a newly developed wire sweep analysis solution (InPack), not only to meet the need of accuracy, but also enhance the efficiency for actual applications. It combines global flow analysis (C-MOLD) and structure analysis (ANSYS) to become a solution for general wire sweep analysis.

Original languageEnglish
Pages (from-to)139-143
Number of pages5
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume125
Issue number1
DOIs
Publication statusPublished - 2003 Dec 8

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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