An electroplating method for copper plane twin boundary manufacturing

Yu Sheng Wang, Wen Hsi Lee, Shih Chieh Chang, Jun Nan Nian, Ying Lang Wang

Research output: Contribution to journalArticlepeer-review

23 Citations (Scopus)


A twin boundary is a special kind of grain boundary that plays an important role in the deformation process of nanocrystalline metals, as it may affect the migration of atoms and electrons in polycrystalline solids, resulting in different electrical and mechanical properties. In this study, plane twin structures were introduced into an electroplated copper film by an electroplating method that inserts an interlayer film with a very small current density (<3 mA/cm2). It was found that the small-current interlayer formed a demarcation line for copper grain growth, and enhanced the twin boundaries by self-annealing at room temperature. Based on this, a method was developed to manufacture multi-plane twin boundaries to improve electron migration. Transmission electron microscopy, focused ion beam analysis, and secondary ion mass spectrometry were employed to examine this interesting phenomenon.

Original languageEnglish
Pages (from-to)157-161
Number of pages5
JournalThin Solid Films
Publication statusPublished - 2013 Oct 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry


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