An electroplating method for copper plane twin boundary manufacturing

Yu Sheng Wang, Wen-Shi Lee, Shih Chieh Chang, Jun Nan Nian, Ying Lang Wang

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

A twin boundary is a special kind of grain boundary that plays an important role in the deformation process of nanocrystalline metals, as it may affect the migration of atoms and electrons in polycrystalline solids, resulting in different electrical and mechanical properties. In this study, plane twin structures were introduced into an electroplated copper film by an electroplating method that inserts an interlayer film with a very small current density (<3 mA/cm2). It was found that the small-current interlayer formed a demarcation line for copper grain growth, and enhanced the twin boundaries by self-annealing at room temperature. Based on this, a method was developed to manufacture multi-plane twin boundaries to improve electron migration. Transmission electron microscopy, focused ion beam analysis, and secondary ion mass spectrometry were employed to examine this interesting phenomenon.

Original languageEnglish
Pages (from-to)157-161
Number of pages5
JournalThin Solid Films
Volume544
DOIs
Publication statusPublished - 2013 Oct 1

Fingerprint

electroplating
Electroplating
Copper
manufacturing
copper
Die casting inserts
Electrons
interlayers
Focused ion beams
Secondary ion mass spectrometry
Grain growth
Grain boundaries
Electric properties
Current density
Metals
Annealing
inserts
Transmission electron microscopy
Atoms
Mechanical properties

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this

Wang, Yu Sheng ; Lee, Wen-Shi ; Chang, Shih Chieh ; Nian, Jun Nan ; Wang, Ying Lang. / An electroplating method for copper plane twin boundary manufacturing. In: Thin Solid Films. 2013 ; Vol. 544. pp. 157-161.
@article{f9d08d02c1834e9d82643cf06a6fef36,
title = "An electroplating method for copper plane twin boundary manufacturing",
abstract = "A twin boundary is a special kind of grain boundary that plays an important role in the deformation process of nanocrystalline metals, as it may affect the migration of atoms and electrons in polycrystalline solids, resulting in different electrical and mechanical properties. In this study, plane twin structures were introduced into an electroplated copper film by an electroplating method that inserts an interlayer film with a very small current density (<3 mA/cm2). It was found that the small-current interlayer formed a demarcation line for copper grain growth, and enhanced the twin boundaries by self-annealing at room temperature. Based on this, a method was developed to manufacture multi-plane twin boundaries to improve electron migration. Transmission electron microscopy, focused ion beam analysis, and secondary ion mass spectrometry were employed to examine this interesting phenomenon.",
author = "Wang, {Yu Sheng} and Wen-Shi Lee and Chang, {Shih Chieh} and Nian, {Jun Nan} and Wang, {Ying Lang}",
year = "2013",
month = "10",
day = "1",
doi = "10.1016/j.tsf.2013.03.131",
language = "English",
volume = "544",
pages = "157--161",
journal = "Thin Solid Films",
issn = "0040-6090",
publisher = "Elsevier",

}

An electroplating method for copper plane twin boundary manufacturing. / Wang, Yu Sheng; Lee, Wen-Shi; Chang, Shih Chieh; Nian, Jun Nan; Wang, Ying Lang.

In: Thin Solid Films, Vol. 544, 01.10.2013, p. 157-161.

Research output: Contribution to journalArticle

TY - JOUR

T1 - An electroplating method for copper plane twin boundary manufacturing

AU - Wang, Yu Sheng

AU - Lee, Wen-Shi

AU - Chang, Shih Chieh

AU - Nian, Jun Nan

AU - Wang, Ying Lang

PY - 2013/10/1

Y1 - 2013/10/1

N2 - A twin boundary is a special kind of grain boundary that plays an important role in the deformation process of nanocrystalline metals, as it may affect the migration of atoms and electrons in polycrystalline solids, resulting in different electrical and mechanical properties. In this study, plane twin structures were introduced into an electroplated copper film by an electroplating method that inserts an interlayer film with a very small current density (<3 mA/cm2). It was found that the small-current interlayer formed a demarcation line for copper grain growth, and enhanced the twin boundaries by self-annealing at room temperature. Based on this, a method was developed to manufacture multi-plane twin boundaries to improve electron migration. Transmission electron microscopy, focused ion beam analysis, and secondary ion mass spectrometry were employed to examine this interesting phenomenon.

AB - A twin boundary is a special kind of grain boundary that plays an important role in the deformation process of nanocrystalline metals, as it may affect the migration of atoms and electrons in polycrystalline solids, resulting in different electrical and mechanical properties. In this study, plane twin structures were introduced into an electroplated copper film by an electroplating method that inserts an interlayer film with a very small current density (<3 mA/cm2). It was found that the small-current interlayer formed a demarcation line for copper grain growth, and enhanced the twin boundaries by self-annealing at room temperature. Based on this, a method was developed to manufacture multi-plane twin boundaries to improve electron migration. Transmission electron microscopy, focused ion beam analysis, and secondary ion mass spectrometry were employed to examine this interesting phenomenon.

UR - http://www.scopus.com/inward/record.url?scp=84901840126&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84901840126&partnerID=8YFLogxK

U2 - 10.1016/j.tsf.2013.03.131

DO - 10.1016/j.tsf.2013.03.131

M3 - Article

VL - 544

SP - 157

EP - 161

JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

ER -