TY - GEN
T1 - An experimental study on the effects of abrasive particle sizes on polishing phenomena
AU - Jeng, Yeau Ren
AU - Huang, Pay Yau
PY - 2006/1/1
Y1 - 2006/1/1
N2 - The effects of abrasive particle size on polishing phenomena during wafer planarization are investigated using a high precision polishing process test bench with in-situ measurement technology. The present experimental results are found to be comported with the experimental and theoretical data published previously. The current experimental outcomes can help to understand the polishing mechanism and develop the relating theoretical model.
AB - The effects of abrasive particle size on polishing phenomena during wafer planarization are investigated using a high precision polishing process test bench with in-situ measurement technology. The present experimental results are found to be comported with the experimental and theoretical data published previously. The current experimental outcomes can help to understand the polishing mechanism and develop the relating theoretical model.
UR - http://www.scopus.com/inward/record.url?scp=35348924288&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=35348924288&partnerID=8YFLogxK
U2 - 10.4028/0-87849-990-3.301
DO - 10.4028/0-87849-990-3.301
M3 - Conference contribution
AN - SCOPUS:35348924288
SN - 0878499903
SN - 9780878499908
T3 - Materials Science Forum
SP - 301
EP - 306
BT - Progress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture
PB - Trans Tech Publications Ltd
T2 - 2005 International Conference on Advanced Manufacture, ICAM2005
Y2 - 28 November 2005 through 2 December 2005
ER -