An innovative material consisting of diamond deposited on a carbon-carbon composite with metallic layer(s) on the diamond surface is described. The carbon-carbon composite produced exhibits a very high thermal conductivity approaching 1000 W m-1 K-1 at room temperature. The diamond film deposited on the composite significantly reduces the surface electrical conductivity to meet the requirement of electrical isolation for electronic devices. Metallization on the diamond surface was demonstrated. Good adhesion between the diamond and the metal layers was achieved, both before and after thermal cycling.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Mechanical Engineering
- Materials Chemistry
- Electrical and Electronic Engineering