An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

Shatil Haque, Kun Xing, Ray Lee Lin, Carlos T.A. Suchicital, Member Guo-Quan Lu

Research output: Contribution to journalArticle

54 Citations (Scopus)

Abstract

Power electronics building blocks (PEBB's) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At the Center for Power Electronics Systems, we developed a topology for a basic building block-a twoswitch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiberoptic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double of what could not be achieved with commercially packaged devices of the same rating.

Original languageEnglish
Pages (from-to)136-144
Number of pages9
JournalIEEE Transactions on Advanced Packaging
Volume22
Issue number2
DOIs
Publication statusPublished - 1999 Dec 1

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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