An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

S. Haque, Kun Xing, Ray Lee Lin, C. Suchicital, G. Q. Lu, D. J. Nelson, D. Borojevic, F. C. Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Power Electronics Building Blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At Virginia Power Electronics Center (VPEC), we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double of what could not be achieved with commercially packaged devices of the same rating.

Original languageEnglish
Title of host publication1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages922-929
Number of pages8
ISBN (Print)0780345266
DOIs
Publication statusPublished - 1998
Event48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States
Duration: 1998 May 251998 May 28

Publication series

NameProceedings - Electronic Components and Technology Conference
VolumePart F133492
ISSN (Print)0569-5503

Other

Other48th Electronic Components and Technology Conference, ECTC 1998
Country/TerritoryUnited States
CitySeattle
Period98-05-2598-05-28

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures'. Together they form a unique fingerprint.

Cite this