TY - GEN
T1 - An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures
AU - Haque, S.
AU - Xing, Kun
AU - Lin, Ray Lee
AU - Suchicital, C.
AU - Lu, G. Q.
AU - Nelson, D. J.
AU - Borojevic, D.
AU - Lee, F. C.
N1 - Funding Information:
This work is funded by the Office of Naval Research.
Publisher Copyright:
© 1998 IEEE.
PY - 1998
Y1 - 1998
N2 - Power Electronics Building Blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At Virginia Power Electronics Center (VPEC), we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double of what could not be achieved with commercially packaged devices of the same rating.
AB - Power Electronics Building Blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At Virginia Power Electronics Center (VPEC), we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double of what could not be achieved with commercially packaged devices of the same rating.
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U2 - 10.1109/ECTC.1998.678819
DO - 10.1109/ECTC.1998.678819
M3 - Conference contribution
AN - SCOPUS:0031625150
SN - 0780345266
T3 - Proceedings - Electronic Components and Technology Conference
SP - 922
EP - 929
BT - 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 48th Electronic Components and Technology Conference, ECTC 1998
Y2 - 25 May 1998 through 28 May 1998
ER -