TY - JOUR
T1 - An inverse design method for optimizing design parameters of heat sink modules with encapsulated chip
AU - Huang, Cheng Hung
AU - Chang, Wei Lun
N1 - Funding Information:
This work was supported in part through the National Science Council, R. O. C. , Grant number, NSC-100-2221-E-006-011-MY3 .
PY - 2012/7
Y1 - 2012/7
N2 - A three-dimensional inverse design problem in estimating the design variables for heat sink modules with an encapsulated chip is solved in the present study by using the Levenberg-Marquardt Method (LMM) and the general purpose commercial code CFD-ACE+ in an irregular domain. Three different types of heat sinks are examined at a fixed fin array volume to determine the most efficient type of heat sink. Moreover, Aluminum and Copper heat sinks are compared to find the optimum design of the module. Results obtained by using the LMM to solve this 3-D inverse design problem are justified based on the numerical experiments and it is concluded that the double row plate fin type heat sink performs best since it can obtain the lowest temperature distribution on the bottom surface of heat sink module. Moreover, larger heat transfer area of heat sink does not guarantee better thermal performance. Due to higher thermal conductivity of Copper heat sink, it also has better thermal performance than the Aluminum heat sink.
AB - A three-dimensional inverse design problem in estimating the design variables for heat sink modules with an encapsulated chip is solved in the present study by using the Levenberg-Marquardt Method (LMM) and the general purpose commercial code CFD-ACE+ in an irregular domain. Three different types of heat sinks are examined at a fixed fin array volume to determine the most efficient type of heat sink. Moreover, Aluminum and Copper heat sinks are compared to find the optimum design of the module. Results obtained by using the LMM to solve this 3-D inverse design problem are justified based on the numerical experiments and it is concluded that the double row plate fin type heat sink performs best since it can obtain the lowest temperature distribution on the bottom surface of heat sink module. Moreover, larger heat transfer area of heat sink does not guarantee better thermal performance. Due to higher thermal conductivity of Copper heat sink, it also has better thermal performance than the Aluminum heat sink.
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U2 - 10.1016/j.applthermaleng.2012.02.016
DO - 10.1016/j.applthermaleng.2012.02.016
M3 - Article
AN - SCOPUS:84857666130
VL - 40
SP - 216
EP - 226
JO - Journal of Heat Recovery Systems
JF - Journal of Heat Recovery Systems
SN - 1359-4311
ER -