An inverse problem in estimating the volumetric heat generation for a three-dimensional encapsulated chip

Cheng-Hung Huang, Wei Lun Chang

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

A three-dimensional inverse heat conduction problem is solved in the present study by using the conjugate gradient method (CGM) and the general-purpose commercial code CFD (ACE) to estimate the strength of the unknown heat generation for an encapsulated chip in a three-dimensional irregular domain. The advantage of calling CFD (ACE) code as a subroutine in the present inverse calculation lies in that many difficult but practical 3D inverse problem can be solved under this construction since the generalpurpose commercial code has the ability to solve the direct problem easily. The results obtained by using the CGM to solve this 3D inverse problem are justified based on the numerical experiments using the simulated exact and inexact measurements. It is concluded that reliable heat generation can be estimated by the present inverse algorithm.

Original languageEnglish
Pages (from-to)110041-110049
Number of pages9
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume132
Issue number1
DOIs
Publication statusPublished - 2010 Mar 1

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Computer Science Applications
  • Mechanics of Materials

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