Analyses and experimental confirmation of removal performance of silicon oxide film in the chemical-mechanical polishing (CMP) process with pattern geometry of concentric groove pads
Chin Chung Wei, Jeng Haur Horng, An Chen Lee, Jen Fin Lin
Fingerprint
Dive into the research topics of 'Analyses and experimental confirmation of removal performance of silicon oxide film in the chemical-mechanical polishing (CMP) process with pattern geometry of concentric groove pads'. Together they form a unique fingerprint.