Analysis and design of a 1.3-mW current-reuse RF front-end for the MICS band

Hugo Cruz, Hong Yi Huang, Shuenn Yuh Lee, Ching Hsing Luo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

This paper presents a wide-band low-power super-heterodyne RF front-end for the Medical Implant Communications Services (MICS) band. The front-end consists of a low-noise amplifier (LNA), a mixer, buffers, and passive baluns. The proposed circuits feature the techniques of current-reuse, MOSFET back-gate coupling, feedback, and current bleeding to achieve low power under acceptable noise figure (NF) levels for the MICS application. The RF front-end is implemented in 0.18um standard CMOS process with an area of 1.4mm×1.2mm at a supply voltage of 1.8V. Measurement results reveal the capability of a minimum sensitivity of -97dBm, maximum conversion gain of 30dB, and total noise figure (NF) of 11.6 and 13.2 dB while consuming 1.3mW and 2.9mW, respectively.

Original languageEnglish
Title of host publication2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1360-1363
Number of pages4
ISBN (Print)9781479934324
DOIs
Publication statusPublished - 2014 Jan 1
Event2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014 - Melbourne, VIC, Australia
Duration: 2014 Jun 12014 Jun 5

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
ISSN (Print)0271-4310

Other

Other2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014
CountryAustralia
CityMelbourne, VIC
Period14-06-0114-06-05

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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    Cruz, H., Huang, H. Y., Lee, S. Y., & Luo, C. H. (2014). Analysis and design of a 1.3-mW current-reuse RF front-end for the MICS band. In 2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014 (pp. 1360-1363). [6865396] (Proceedings - IEEE International Symposium on Circuits and Systems). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISCAS.2014.6865396