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Analysis of fatigue delamination growth in flip-chip package
Y. S. Lai, C. H. Chen,
T. C. Chiu
Department of Mechanical Engineering
Research output
:
Contribution to journal
›
Article
›
peer-review
7
Citations (Scopus)
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Mathematics
Flip chip
100%
Fatigue
66%
Cycling
50%
Defects
49%
Crack
47%
Crack Growth Rate
21%
Cyclic Loading
19%
Energy Release Rate
18%
Crack Growth
17%
Silicon
17%
Driving Force
16%
Fracture Mechanics
16%
Strain Energy
15%
Stress Intensity Factor
14%
Growth Model
13%
Die
13%
Electronics
12%
Predict
11%
Angle
10%
Engineering & Materials Science
Delamination
48%
Fatigue of materials
33%
Defects
33%
Cracks
33%
Crack propagation
21%
Flip chip devices
20%
Temperature
14%
Energy release rate
14%
Strain energy
13%
Fracture mechanics
12%
Stress intensity factors
12%
Silicon
9%