TY - GEN
T1 - Analysis of Flip-Chip corner delamination using 3-D virtual crack closure technique
AU - Chiu, Tz Cheng
AU - Lin, Huang Chun
AU - Yang, Hung Chun
PY - 2008
Y1 - 2008
N2 - The problem of an overmolded flip-chip containing a die-underfill interface corner crack subjected to thermomechanical loading is investigated by using finite element simulation. The fracture mechanics parameters including the stress intensity factors and strain energy release rate along the corner crack front are determined by using a three-dimensional virtual crack closure technique. Effect of the interface corner crack shape on the propensity of crack propagation is discussed.
AB - The problem of an overmolded flip-chip containing a die-underfill interface corner crack subjected to thermomechanical loading is investigated by using finite element simulation. The fracture mechanics parameters including the stress intensity factors and strain energy release rate along the corner crack front are determined by using a three-dimensional virtual crack closure technique. Effect of the interface corner crack shape on the propensity of crack propagation is discussed.
UR - http://www.scopus.com/inward/record.url?scp=64049118520&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=64049118520&partnerID=8YFLogxK
U2 - 10.1109/EMAP.2008.4784253
DO - 10.1109/EMAP.2008.4784253
M3 - Conference contribution
AN - SCOPUS:64049118520
SN - 9781424436217
T3 - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
SP - 157
EP - 160
BT - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
T2 - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Y2 - 22 October 2008 through 24 October 2008
ER -