Analysis of Flip-Chip corner delamination using 3-D virtual crack closure technique

Tz-Cheng Chiu, Huang Chun Lin, Hung Chun Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The problem of an overmolded flip-chip containing a die-underfill interface corner crack subjected to thermomechanical loading is investigated by using finite element simulation. The fracture mechanics parameters including the stress intensity factors and strain energy release rate along the corner crack front are determined by using a three-dimensional virtual crack closure technique. Effect of the interface corner crack shape on the propensity of crack propagation is discussed.

Original languageEnglish
Title of host publication2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Pages157-160
Number of pages4
DOIs
Publication statusPublished - 2008
Event2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 - Taipei, Taiwan
Duration: 2008 Oct 222008 Oct 24

Other

Other2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
CountryTaiwan
CityTaipei
Period08-10-2208-10-24

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Mechanical Engineering

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