Abstract
A gate-induced-drain-leakage-induced off-state breakdown is examined in our high-voltage depletion-mode n-channel metal-oxide-semiconductor field-effect transistors. By increasing the dosage in the n-region, a bell-shaped trend between the off-state breakdown voltage VBD and the dosage in the n-region is observed. Such a bell-shaped trend is found to result from two competing factors: an electric field in the gate edge and an electric field associated with the drainbulk junction. The latter electric field is responsible for the falling part in the bell-shaped trend. Our model can explain the data of the slightly bell-shaped trend between off-state VBD and implant energy in the n-region. Additionally, the effect of Si recess variation on off-state VBD variation can be understood from our model. According to our model, approaches to improve off-state VBD and the effect of Si recess variation on VBD variation are proposed.
Original language | English |
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Article number | 5742996 |
Pages (from-to) | 1608-1613 |
Number of pages | 6 |
Journal | IEEE Transactions on Electron Devices |
Volume | 58 |
Issue number | 6 |
DOIs | |
Publication status | Published - 2011 Jun |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering