Analytical modeling and numerical simulations of temperature field in TSV-based 3D ICs

Yuriy Shiyanovskii, Chris Papachristou, Cheng Wen Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Three dimensional (3D) integrated circuit (IC) technology is emerging as a potential alternative to address the physical limitations in miniaturization of the current 2D semiconductor devices. The 3D IC integration is based on the concept of through-silicon vias (TSV) and vertical stacking of multiple active layers. TSV-based 3D IC's offer significant advantages in performance due to reduction in interconnect lengths, and design flexibility in vertical floor planning. However, a critical challenge for the 3D IC integration is thermal management. In this paper, we present a new analytical 3D model and numerical simulations of the temperature field for the 3D chip using the formalism of inplane orthogonal functions. The model takes into account heat transfer through external surfaces of the chip, inhomogeneous electric heating within the layer (localized heating), inter layer heat transfer with possible inhomogeneous TSV placement and micro channel cooling. Our simulations implement the proposed model and demonstrate its viability and computational efficiency for temperature field optimization.

Original languageEnglish
Title of host publicationProceedings of the 14th International Symposium on Quality Electronic Design, ISQED 2013
Pages24-29
Number of pages6
DOIs
Publication statusPublished - 2013 Jul 5
Event14th International Symposium on Quality Electronic Design, ISQED 2013 - Santa Clara, CA, United States
Duration: 2013 Mar 42013 Mar 6

Publication series

NameProceedings - International Symposium on Quality Electronic Design, ISQED
ISSN (Print)1948-3287
ISSN (Electronic)1948-3295

Other

Other14th International Symposium on Quality Electronic Design, ISQED 2013
CountryUnited States
CitySanta Clara, CA
Period13-03-0413-03-06

Fingerprint

Temperature distribution
Silicon
Computer simulation
Electric heating
Heat transfer
Orthogonal functions
Semiconductor devices
Computational efficiency
Temperature control
Cooling
Heating
Planning
Three dimensional integrated circuits

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Shiyanovskii, Y., Papachristou, C., & Wu, C. W. (2013). Analytical modeling and numerical simulations of temperature field in TSV-based 3D ICs. In Proceedings of the 14th International Symposium on Quality Electronic Design, ISQED 2013 (pp. 24-29). [6523585] (Proceedings - International Symposium on Quality Electronic Design, ISQED). https://doi.org/10.1109/ISQED.2013.6523585
Shiyanovskii, Yuriy ; Papachristou, Chris ; Wu, Cheng Wen. / Analytical modeling and numerical simulations of temperature field in TSV-based 3D ICs. Proceedings of the 14th International Symposium on Quality Electronic Design, ISQED 2013. 2013. pp. 24-29 (Proceedings - International Symposium on Quality Electronic Design, ISQED).
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Shiyanovskii, Y, Papachristou, C & Wu, CW 2013, Analytical modeling and numerical simulations of temperature field in TSV-based 3D ICs. in Proceedings of the 14th International Symposium on Quality Electronic Design, ISQED 2013., 6523585, Proceedings - International Symposium on Quality Electronic Design, ISQED, pp. 24-29, 14th International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, United States, 13-03-04. https://doi.org/10.1109/ISQED.2013.6523585

Analytical modeling and numerical simulations of temperature field in TSV-based 3D ICs. / Shiyanovskii, Yuriy; Papachristou, Chris; Wu, Cheng Wen.

Proceedings of the 14th International Symposium on Quality Electronic Design, ISQED 2013. 2013. p. 24-29 6523585 (Proceedings - International Symposium on Quality Electronic Design, ISQED).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Shiyanovskii Y, Papachristou C, Wu CW. Analytical modeling and numerical simulations of temperature field in TSV-based 3D ICs. In Proceedings of the 14th International Symposium on Quality Electronic Design, ISQED 2013. 2013. p. 24-29. 6523585. (Proceedings - International Symposium on Quality Electronic Design, ISQED). https://doi.org/10.1109/ISQED.2013.6523585