TY - JOUR
T1 - Anisotropic heat conduction across an interface crack/defect filled with a thin interstitial medium
AU - Shiah, Y. C.
AU - Shi, Yi Xiao
N1 - Funding Information:
The authors gratefully acknowledge the financial support by the National Science Council of Taiwan (Grant no.: NSC94-2212-E-035-011).
PY - 2006/5
Y1 - 2006/5
N2 - The present work investigates the heat conduction across an interface crack/defect filled with a thin-layer of interstitial medium between dissimilar anisotropic materials. The problem is simulated using two independent approaches in the boundary element method. One is to consider the presence of a thin layer of an isotropic medium, while the other is to adopt a gap conductance equation without considering the interstitial medium. Comparison of numerical results reveals that the gap conductance coefficient is independent of the material properties of adjoined materials that are believed to be involved. A simple, yet useful relation to give the gap conductance coefficient is presented in this paper.
AB - The present work investigates the heat conduction across an interface crack/defect filled with a thin-layer of interstitial medium between dissimilar anisotropic materials. The problem is simulated using two independent approaches in the boundary element method. One is to consider the presence of a thin layer of an isotropic medium, while the other is to adopt a gap conductance equation without considering the interstitial medium. Comparison of numerical results reveals that the gap conductance coefficient is independent of the material properties of adjoined materials that are believed to be involved. A simple, yet useful relation to give the gap conductance coefficient is presented in this paper.
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U2 - 10.1016/j.enganabound.2006.01.012
DO - 10.1016/j.enganabound.2006.01.012
M3 - Article
AN - SCOPUS:33748191246
VL - 30
SP - 325
EP - 337
JO - Engineering Analysis with Boundary Elements
JF - Engineering Analysis with Boundary Elements
SN - 0955-7997
IS - 5
ER -