This paper investigates the application of a Taguchi method to reduce warpage problem dealing with process parameters during production of bonding sheets. For this purpose, analysis was carried out by utilizing a combination of process parameters based on a two-level L12 Taguchi orthogonal design. The signal-to-noise and the analysis of variance are used to find the optimum levels and to indicate the impact of the process parameters on warpage. The results show that the method can reduce warpage by about 94%, and a verification test is also conducted to prove its effectiveness after the optimum levels of process parameters are determined. It can thus be concluded that this Taguchi method is suitable to solve the quality problems that occur due to warpage.
|Journal||Journal of Electronic Packaging, Transactions of the ASME|
|Publication status||Published - 2010 Dec 6|
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Computer Science Applications
- Electrical and Electronic Engineering