Application of viscoelastic model for simulating process-induced warpage of ball grid array packages

J. L. Gung; H. W. Huang; T. C. Chiu; Y. S. Lai

doi:10.1109/IMPACT.2009.5382296

Application of viscoelastic model for simulating process-induced warpage of ball grid array packages

J. L. Gung, H. W. Huang, T. C. Chiu, Y. S. Lai

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

11 Citations (Scopus)

Abstract

Warpage evolution of an overmolded BGA package either under uniform temperature excursion or during post-mold curing process is analyzed by using finite element simulation with a cure-dependent viscoelastic model for the molding compound. Additional finite element analyses are performed to compare molding compound constitutive behavior (temperature-dependent elastic or viscoelastic) on the package warpage prediction. Through shadow Moiré experimental validation, it is observed that the prediction with viscoelastic constitutive model agrees well to the measured values; while the elastic model overestimates package warpage.

Original language	English
Title of host publication	IMPACT Conference 2009 International 3D IC Conference - Proceedings
Pages	6-9
Number of pages	4
DOIs	https://doi.org/10.1109/IMPACT.2009.5382296
Publication status	Published - 2009 Dec 1
Event	IMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan Duration: 2009 Oct 21 → 2009 Oct 23

Publication series

Name	IMPACT Conference 2009 International 3D IC Conference - Proceedings

Other

Other	IMPACT Conference 2009 International 3D IC Conference
Country/Territory	Taiwan
City	Taipei
Period	09-10-21 → 09-10-23

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/IMPACT.2009.5382296

Cite this

Gung, J. L., Huang, H. W., Chiu, T. C., & Lai, Y. S. (2009). Application of viscoelastic model for simulating process-induced warpage of ball grid array packages. In IMPACT Conference 2009 International 3D IC Conference - Proceedings (pp. 6-9). Article 5382296 (IMPACT Conference 2009 International 3D IC Conference - Proceedings). https://doi.org/10.1109/IMPACT.2009.5382296

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title = "Application of viscoelastic model for simulating process-induced warpage of ball grid array packages",

abstract = "Warpage evolution of an overmolded BGA package either under uniform temperature excursion or during post-mold curing process is analyzed by using finite element simulation with a cure-dependent viscoelastic model for the molding compound. Additional finite element analyses are performed to compare molding compound constitutive behavior (temperature-dependent elastic or viscoelastic) on the package warpage prediction. Through shadow Moir{\'e} experimental validation, it is observed that the prediction with viscoelastic constitutive model agrees well to the measured values; while the elastic model overestimates package warpage.",

author = "Gung, {J. L.} and Huang, {H. W.} and Chiu, {T. C.} and Lai, {Y. S.}",

year = "2009",

month = dec,

day = "1",

doi = "10.1109/IMPACT.2009.5382296",

language = "English",

isbn = "9781424443413",

series = "IMPACT Conference 2009 International 3D IC Conference - Proceedings",

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booktitle = "IMPACT Conference 2009 International 3D IC Conference - Proceedings",

note = "IMPACT Conference 2009 International 3D IC Conference ; Conference date: 21-10-2009 Through 23-10-2009",

}

Gung, JL, Huang, HW, Chiu, TC & Lai, YS 2009, Application of viscoelastic model for simulating process-induced warpage of ball grid array packages. in IMPACT Conference 2009 International 3D IC Conference - Proceedings., 5382296, IMPACT Conference 2009 International 3D IC Conference - Proceedings, pp. 6-9, IMPACT Conference 2009 International 3D IC Conference, Taipei, Taiwan, 09-10-21. https://doi.org/10.1109/IMPACT.2009.5382296

Application of viscoelastic model for simulating process-induced warpage of ball grid array packages. / Gung, J. L.; Huang, H. W.; Chiu, T. C. et al.
IMPACT Conference 2009 International 3D IC Conference - Proceedings. 2009. p. 6-9 5382296 (IMPACT Conference 2009 International 3D IC Conference - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Application of viscoelastic model for simulating process-induced warpage of ball grid array packages

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PY - 2009/12/1

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N2 - Warpage evolution of an overmolded BGA package either under uniform temperature excursion or during post-mold curing process is analyzed by using finite element simulation with a cure-dependent viscoelastic model for the molding compound. Additional finite element analyses are performed to compare molding compound constitutive behavior (temperature-dependent elastic or viscoelastic) on the package warpage prediction. Through shadow Moiré experimental validation, it is observed that the prediction with viscoelastic constitutive model agrees well to the measured values; while the elastic model overestimates package warpage.

AB - Warpage evolution of an overmolded BGA package either under uniform temperature excursion or during post-mold curing process is analyzed by using finite element simulation with a cure-dependent viscoelastic model for the molding compound. Additional finite element analyses are performed to compare molding compound constitutive behavior (temperature-dependent elastic or viscoelastic) on the package warpage prediction. Through shadow Moiré experimental validation, it is observed that the prediction with viscoelastic constitutive model agrees well to the measured values; while the elastic model overestimates package warpage.

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BT - IMPACT Conference 2009 International 3D IC Conference - Proceedings

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Y2 - 21 October 2009 through 23 October 2009

ER -

Application of viscoelastic model for simulating process-induced warpage of ball grid array packages

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