Applications of LIGA on micro-punching process for metallic materials

C. T. Pan, P. J. Cheng, S. C. Shen, M. F. Chen, R. Y. Wang, M. C. Chou, T. C. Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)


This study presents an innovative imprinting method to fabricate IC devices by micro-punch process. Normally, imprinting method is used to imprint plastic materials such as photoresist and polymeric materials. In this study, imprinting process is applied to micro-punch metallic materials directly for IC devices. Fabrications of IC devices with high aspect ratio structures ranging from micrometer to sub-micrometer are described. In this study, to keep the production costs as low as possible, a complete micro-punching process is applied to replicate IC devices. A combination of lithography, extra-hard alloy nickel cobalt (Ni/Co) electroplating process (as a metal imprint mold for punch) and chemical mechanic polishing (CMP) process is used to flat the extra-hard alloy micro-punch head. It is worth noticing that the Ni-Co electroplating process with hardness over Hardness of Vicker (Hv) 560 is developed. With such hardness, it can stand the high pressure and abrasivness to confine the accuracy during micro-punching process. With regard to the electroplating process, Ni-Co is deposited and covered on the photoresist template uniformly by electroplating. The Ni/Co mold is served as master for micro-punching process to replicate the pattern onto polyimide (PI) or copper sheets. Finally, the experimental results are measured and characterized.

Original languageEnglish
Title of host publicationProgress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture
PublisherTrans Tech Publications Ltd
Number of pages6
EditionPART 1
ISBN (Print)0878499903, 9780878499908
Publication statusPublished - 2006
Event2005 International Conference on Advanced Manufacture, ICAM2005 - Taipei, R.O.C., Taiwan
Duration: 2005 Nov 282005 Dec 2

Publication series

NameMaterials Science Forum
NumberPART 1
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752


Other2005 International Conference on Advanced Manufacture, ICAM2005
CityTaipei, R.O.C.

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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